Experimental results with a scanning stepper for synchrotron‐based x‐ray lithography Available to Purchase

A second generation of synchrotron‐compatible x‐ray steppers is described which uses the scanning exposure method to minimize overhead time between alignment and exposure. Available x‐ray intensity is increased, since a thin exposure window, only a few mm high, can be used to separate the beam line vacuum from the exposure tool which operates in ambient air. First results indicate sufficient mechanical stability to allow the mask/wafer unit to be scanned in an aligned position.