Microlenses are a suitable approach to improve the performance of optical systems. An important optical efficiency determining parameter is the fill factor, which describes the relation of the lens area to the total optical active area. In this work, an optimization of the fill factor by optimizing the fabrication process steps is presented. The approach here is the use of i-line waferstepper lithography in combination with thermal reflow of photoresist and subsequent 1:1 pattern transfer in the lens material by reactive ion etching. For this method, the fill factor is determined by the minimum lens gap and, thus, the optical efficiency is strongly limited by the resolution limit of the i-line waferstepper lithography (350 nm). The goal of this investigation is to achieve the lowest possible lens gap even below the stepper-based resolution limit by optimizing each single process step without developing a new approach. The final result of the optimization was a fill factor improvement of 15%.

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