Semiconductor manufacturing technology keeps toward scaling down to a few nanometers. To protect the process yield and achieve the success of chip manufacturing, the center-to-edge uniformity of the wafer's temperature has become a crucial parameter. The thermal characteristics of the wafer are dominantly affected by the electrostatic chuck, which is generally used to support the wafer in the manufacturing process. In particular, the backside gas, which passes through the interface between the wafer and electrostatic chuck, is important for cooling the wafer below a critical temperature. The heat transfer via a backside gas can be explained by the layer-bulk model, and its pressure is a key factor to determine the cooling effectiveness. In this paper, a one-dimensional thermal circuit model is established for a system including the wafer, electrostatic chuck, and backside gas to calculate the convective heat transfer coefficient caused by the backside gas. The numerical results showed that the uniformity of the wafer's temperature became worse as the backside gas pressure increased in a low-pressure range but significantly improved above a critical value of the gas pressure. Based on our findings, we concluded that the backside gas pressure should be optimized to improve the uniformity of the wafer temperature.
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July 2023
Research Article|
May 26 2023
Heat transfer mechanism of electrostatic chuck surface and wafer backside to improve wafer temperature uniformity
Tae Woong Yoon
;
Tae Woong Yoon
(Conceptualization, Data curation, Formal analysis, Investigation, Methodology, Validation, Visualization, Writing – original draft)
1
Department of Electronics Engineering, Myongji University
, 116 Myongji-ro, Cheoin-gu, Yongin-si, Gyeonggi-do 17058, Republic of Korea
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Sung Il Cho;
Sung Il Cho
(Data curation, Investigation, Resources, Visualization, Writing – original draft)
1
Department of Electronics Engineering, Myongji University
, 116 Myongji-ro, Cheoin-gu, Yongin-si, Gyeonggi-do 17058, Republic of Korea
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Minsuk Choi;
Minsuk Choi
(Formal analysis, Supervision, Visualization, Writing – review & editing)
2
Department of Mechanical Engineering, Myongji University
, 116 Myongji-ro, Cheoin-gu, Yongin-si, Gyeonggi-do 17058, Republic of Korea
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Sang Jeen Hong
Sang Jeen Hong
a)
(Conceptualization, Formal analysis, Funding acquisition, Methodology, Supervision, Writing – review & editing)
1
Department of Electronics Engineering, Myongji University
, 116 Myongji-ro, Cheoin-gu, Yongin-si, Gyeonggi-do 17058, Republic of Korea
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a)
Electronic mail: [email protected]
J. Vac. Sci. Technol. B 41, 044002 (2023)
Article history
Received:
April 01 2023
Accepted:
May 03 2023
Citation
Tae Woong Yoon, Sung Il Cho, Minsuk Choi, Sang Jeen Hong; Heat transfer mechanism of electrostatic chuck surface and wafer backside to improve wafer temperature uniformity. J. Vac. Sci. Technol. B 1 July 2023; 41 (4): 044002. https://doi.org/10.1116/6.0002737
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