We report the results of the design, simulation, fabrication, and cold-test measurements of millimeter-band 2D planar microstrip slow-wave structures (SWSs) on dielectric substrates. Such structures have a high slow-wave factor, which allows for low-voltage operation and reduction in the size and weight of the device. A low-cost and flexible fabrication technology based on magnetron sputtering and subsequent laser ablation has been developed and is reported in the paper. Microstrip meander-line SWS circuits at V-, W-, and D-bands have been fabricated and characterized. The fabrication of ring-bar planar SWSs by the photolithographic method is also discussed. Experimental measurement of S-parameters of the fabricated structures reveals good transmission properties. Return loss (S11) does not exceed −10 dB and attenuation is about 2 dB/cm in the V-band, 10 dB/cm in the W-band, and 8.5 dB/cm in the D-band.

1.
V.
Srivastava
,
J. Phys. Conf. Ser.
114
,
012015
(
2008
).
2.
J. H.
Booske
,
R. J.
Dobbs
,
C. D.
Joye
,
C. L.
Kory
,
G. R.
Neil
,
G.-S.
Park
,
J.
Park
, and
R. J.
Temkin
,
IEEE Trans. Terahertz Sci. Technol.
1
,
54
(
2011
).
3.
A. D.
Grigoriev
,
V. A.
Ivanov
, and
S. I.
Molokovsky
,
Microwave Electronics
, Springer Series in Advanced Microelectronics Vol. 61 (
Springer
,
New York
,
2018
).
4.
F.
André
,
J.-C.
Racamier
,
R.
Zimmermann
,
Q. T.
Le
,
V.
Krozer
,
G.
Ulisse
,
D. F. G.
Minenna
,
R.
Letizia
, and
C.
Paoloni
,
IEEE Trans. Electron Devices
67
,
2919
(
2020
).
5.
C. D.
Joye
 et al,
IEEE Trans. Electron Devices
61
,
1672
(
2014
).
6.
M.
Field
 et al,
IEEE Trans. Electron Devices
65
,
2122
(
2018
).
7.
B. R.
Potter
,
A. W.
Scott
, and
J. J.
Tancredi
,
International Electron Devices Meeting
(
IEEE
,
New York
,
1973
), Vol. 521.
8.
S.
Wang
,
S.
Aditya
,
X.
Xia
,
Z.
Ali
, and
J.
Miao
,
IEEE Trans. Electron Devices
65
,
2142
(
2018
).
9.
S.
Wang
,
S.
Aditya
,
X.
Xia
,
Z.
Ali
,
J.
Miao
, and
Y.
Zheng
,
IEEE Trans. Plasma Sci.
47
,
4650
(
2019
).
10.
T.
He
,
X.
Li
,
Z.
Wang
,
S.
Wang
,
Z.
Lu
,
H.
Gong
,
Z.
Duan
,
J.
Feng
, and
Y.
Gong
,
J. Infrared Millimeter Terahertz Waves
41
,
785
(
2020
).
11.
Z.
Wang
,
L.
Su
,
Z.
Duan
,
Q.
Hu
,
H.
Gong
,
Z.
Lu
,
J.
Feng
,
S.
Li
, and
Y.
Gong
,
J. Infrared Millimeter Terahertz Waves
41
,
1460
(
2020
).
12.
A. I.
Benedik
,
A. G.
Rozhnev
,
N. M.
Ryskin
,
N. I.
Sinitsyn
,
G. V.
Torgashov
, and
R. A.
Torgashov
,
18th IEEE International Vacuum Electronics Conference
,
London, United Kingdom
, 24–26 April 2017 (
IEEE
,
New York
,
2017
).
13.
M.
Sumathy
,
D.
Augustin
,
S. K.
Datta
,
L.
Christie
, and
L.
Kumar
,
IEEE Trans. Electron Devices
60
,
1769
(
2013
.
14.
A.
Galdetskiy
and
E.
Rakova
,
18th IEEE International Vacuum Electronics Conference
,
London, United Kingdom
, 24–26 April 2017 (
IEEE
,
New York
,
2017
).
15.
N. M.
Ryskin
 et al,
33rd International Vacuum Nanoelectronics Conference
,
Lyon, France
, 6–10 July 2020 (
IEEE
,
New York
,
2020
).
16.
M. P.
Kirley
and
J. H.
Booske
,
IEEE Trans. Terahertz Sci. Technol.
5
,
1012
(
2015
.
17.
Comsol Multiphysics Engineering Simulation Software (COMSOL Inc., Burlington, MA, 2020), see https://www.comsol.com/comsol-multiphysics.
18.
N. M.
Ryskin
,
A. G.
Rozhnev
,
A. V.
Starodubov
,
A. A.
Serdobintsev
,
A. M.
Pavlov
,
A. I.
Benedik
,
R. A.
Torgashov
,
G. V.
Torgashov
, and
N. I.
Sinitsyn
,
IEEE Electron Device Lett.
39
,
757
(
2018
).
19.
R. A.
Torgashov
,
N. M.
Ryskin
,
A. G.
Rozhnev
,
A. V.
Starodubov
,
A. A.
Serdobintsev
,
A. M.
Pavlov
,
V. V.
Galushka
,
I. S.
Bakhteev
, and
S. Y.
Molchanov
,
Tech. Phys.
65
,
660
(
2020
).
20.
G.
Ulisse
and
V.
Krozer
,
IEEE Electron Device Lett.
38
,
126
(
2017
).
21.
M. J.
Madou
,
Manufacturing Techniques for Microfabrication and Nanotechnology
(
CRC
,
Boca Raton
,
FL
,
2011
).
22.
M. R.
Lueck
,
D. M.
Malta
,
K. H.
Gilchrist
,
C. L.
Kory
,
G. T.
Mearini
, and
J. A.
Dayton
,
J. Micromech. Microeng.
21
,
065022
(
2011
).
23.
D.
Gamzina
,
L. G.
Himes
,
R.
Barchfeld
,
Y.
Zheng
,
B. K.
Popovic
,
C.
Paoloni
,
E. M.
Choi
, and
N. C.
Luhmann
,
IEEE Trans. Electron Devices
63
,
4067
(
2016
).
24.
A. M.
Cook
,
C. D.
Joye
, аnd
J. P.
Calame
,
IEEE Access
7
,
72561
(
2019
).
25.
A. V.
Starodubov
 et al,
International Vacuum Electronics Conference
,
Busan, Korea
, 28 April–1 May 2019 (
IEEE
,
New York
,
2019
).
26.
A. V.
Starodubov
 et al,
Proc. SPIE
11458
,
1145803
(
2019
).
27.
C.
Momma
,
B. N.
Chichkov
,
S.
Nolte
,
F.
von Alvensleben
,
A.
Tiinnermann
,
H.
Welling
, and
B.
Wellegehausen
,
Opt. Commun.
129
,
134
(
1996
).
28.
A. V.
Starodubov
,
A. A.
Serdobintsev
,
A. M.
Pavlov
,
V. V.
Galushka
,
P. V.
Ryabukho
,
A. G.
Rozhnev
,
R. A.
Torgashov
,
G. V.
Torgashov
, and
N. M.
Ryskin
, in
Progress in Electromagnetics Research Symposium
,
Toyama, Japan
, 1–4 August 2018 (
IEEE
,
New York
,
2018
), pp.
926
929
.
29.
A. V.
Starodubov
,
V. V.
Galushka
,
R. A.
Torgashov
,
A. A.
Serdobintsev
,
A. M.
Pavlov
,
G. V.
Torgashov
,
P. V.
Ryabukho
,
A. G.
Rozhnev
, and
N. M.
Ryskin
, in
18th Mediterranean Microwave Symposium (MMS)
,
Istanbul, Turkey
, 31 October–2 November 2018 (
IEEE
,
New York
,
2018
), pp.
128
131
.
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