A physical simulation procedure was used to describe the processes behind the operation of devices based on TiN/Ti/HfO2/W structures. The equations describing the creation and destruction of conductive filaments formed by oxygen vacancies are solved in addition to the heat equation. The resistances connected with the metal electrodes were also considered. Resistive random access memories analyzed were fabricated, and many of the characteristics of the experimental data were reproduced with accuracy. Truncated-cone shaped filaments were employed in the model developed with metallic-like transport characteristics. A hopping current was also taken into account to describe the electron transport between the filament tip and the electrode. Hopping current is an essential component in the device high resistance state.

1.
R.
Waser
and
M.
Aono
,
Nat. Mater.
6
,
833
(
2007
).
2.
J. S.
Lee
,
S.
Lee
, and
T. W.
Noh
,
Appl. Phys. Rev.
2
,
031303
(
2015
).
3.
M.
Bocquet
,
D.
Deleruyelle
,
C.
Muller
, and
J. M.
Portal
,
Appl. Phys. Lett.
98
,
263507
(
2011
).
4.
M. A.
Villena
,
M. B.
González
,
F.
Jiménez-Molinos
,
F.
Campabadal
,
J. B.
Roldán
,
J.
Suñé
,
E.
Romera
, and
E.
Miranda
, J. Appl. Phys.
115
,
214504
(
2014
).
5.
M. A.
Villena
,
M. B.
González
,
J. B.
Roldán
,
F.
Campabadal
,
F.
Jiménez-Molinos
,
F. M.
Gómez-Campos
, and
J.
Suñé
,
Solid State Electron.
111
,
47
(
2015
).
6.
R.
Waser
,
R.
Dittmann
,
G.
Staikov
, and
K.
Szot
,
Adv. Mater.
21
,
2632
(
2009
).
7.
R.
Waser
,
J. Nanosci. Nanotechnol.
12
,
7628
(
2012
).
8.
F.
Pan
,
S.
Gao
,
C.
Chen
,
C.
Song
, and
F.
Zeng
,
Mater. Sci. Eng. Rep.
83
,
1
(
2014
).
9.
10.
S.
Kawabata
 et al.,
paper presented at the 2010 IEEE International Memory Workshop
(
2010
).
11.
C. J.
Chevallier
,
C. H.
Siau
,
S. F.
Lim
,
S. R.
Namala
,
M.
Matsuoka
,
B. L.
Bateman
, and
D.
Rinerson
,
paper presented at the 2010 IEEE International Solid-State Circuits Conference
(
2010
).
12.
W.
Otsuka
,
K.
Miyata
,
M.
Kitagawa
,
K.
Tsutsui
,
T.
Tsushima
,
H.
Yoshihara
,
T.
Namise
,
Y.
Terao
, and
K.
Ogata
,
paper presented at the 2011 IEEE International Solid-State Circuits Conference
(
2011
).
13.
A.
Kawahara
 et al.,
IEEE J. Solid-State Circuits
48
,
178
(
2013
).
14.
T.-y.
Liu
 et al.,
IEEE J. Solid-State Circuits
49
,
140
(
2014
).
15.
R.
Fackenthal
 et al.,
paper presented at the International Solid-State Circuits Conference Digest of Technical Papers
(
2014
).
16.
H. S. P.
Wong
,
H.-Y.
Lee
,
S.
Yu
,
Y.-S.
Chen
,
Y.
Wu
,
P.-S.
Chen
,
B.
Lee
,
F. T.
Chen
, and
M.-J.
Tsai
,
Proc. IEEE
100
,
1951
(
2012
).
17.
M. A.
Villena
,
F.
Jiménez-Molinos
,
J. B.
Roldán
,
J.
Suñé
,
S.
Long
,
X.
Lian
,
F.
Gámiz
, and
M.
Liu
,
J. Appl. Phys.
114
,
144505
(
2013
).
18.
U.
Russo
,
D.
Ielmini
,
C.
Cagli
,
A. L.
Lacaita
,
S.
Spiga
,
C.
Wiemer
,
M.
Perego
, and
M.
Fanciulli
,
paper presented at the 2007 IEEE International Electron Devices Meeting
(
2007
).
19.
P.
Sheridan
,
K. H.
Kim
,
S.
Gaba
,
T.
Chang
,
L.
Chena
, and
W.
Lu
,
Nanoscale
3
,
3833
(
2011
).
20.
X.
Guan
,
S.
Yu
, and
H.-S. P.
Wong
,
IEEE Electron Device Lett.
33
,
1405
(
2012
).
21.
P.
Huang
 et al.,
IEEE Trans. Electron Devices
60
,
4090
(
2013
).
22.
M.
Bocquet
,
D.
Deleruyelle
,
H.
Aziza
,
C.
Muller
, and
J. M.
Portal
,
paper presented at the 2013 IEEE Faible Tension Faible Consommation
(
2013
).
23.
Stanford University resistive-switching random access memory (RRAM) Verilog-A Model 1.0.0
,” accessed 18 October
2016
, https://nanohub.org/publications/19/1.
24.
M.
Bocquet
,
D.
Deleruyelle
,
H.
Aziza
,
C.
Muller
,
J.-M.
Portal
,
T.
Cabout
, and
E.
Jalaguier
,
IEEE Trans. Electron Devices
61
,
674
(
2014
).
25.
F.
Jiménez-Molinos
,
M. A.
Villena
,
J. B.
Roldán
, and
A. M.
Roldán
,
IEEE Trans. Electron Devices
62
,
955
(
2015
).
26.
R.
Degraeve
 et al.,
2012 Symposium on VLSI technology
(
2012
), p.
T75
.
27.
D. H.
Kwon
 et al.,
Nat. Nanotechnol.
5
,
148
(
2010
).
28.
G.
González-Cordero
,
J. B.
Roldán
,
F.
Jiménez-Molinos
,
J.
Suñé
,
S.
Long
, and
M.
Liu
,
Semicond. Sci. Technol.
31
,
115013
(
2016
).
29.
S.
Larentis
,
F.
Nardi
,
S.
Balatti
,
D. C.
Gilmer
, and
D.
Ielmini
,
IEEE Trans. Electron Devices
59
,
2468
(
2012
).
You do not currently have access to this content.