In this study, NiN-based resistive switching (RS) random access memory was doped with various concentrations of oxygen, and its uniform set/reset operation and current levels were examined. As compared with undoped RS layers, RS layers deposited with an oxygen flow rate of 5 sccm were more uniform and exhibited higher on/off ratios by forming oxy-nitride. In contrast, RS layers deposited with oxygen flow rates less than 5 sccm showed poor performance due to oxygen acting as a defect. The authors demonstrated that the oxygen doping process can improve the RS characteristics of NiN films and help clarify the RS phenomena associated with these films.
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