An integration scheme of block copolymer directed assembly with 193 nm immersion lithography is presented. It is experimentally shown that a thin silicon nitride film can be used as an antireflective coating (ARC). With such an ARC, directed assembly of a block copolymer (BCP) to triple the feature density of a chemical pattern was demonstrated. A high quality of assembly was obtained over a large area, and pattern transfer feasibility was illustrated. The integration of feature density multiplication via directed assembly of a BCP with 193 nm immersion lithography provided a pattern quality that was comparable with existing double patterning techniques, suggesting that the process could be a promising candidate for extending the use of current 193 immersion lithography tools to higher pattern densities.
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November 2010
Research Article|
November 30 2010
Integration of block copolymer directed assembly with 193 immersion lithography
Chi-Chun Liu;
Chi-Chun Liu
Department of Chemical and Biological Engineering,
University of Wisconsin–Madison
, Madison, Wisconsin 53706
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Paul F. Nealey;
Paul F. Nealey
a)
Department of Chemical and Biological Engineering,
University of Wisconsin–Madison
, Madison, Wisconsin 53706
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Alex K. Raub;
Alex K. Raub
Center for High Technology Materials,
University of New Mexico
, Albuquerque, New Mexico 87106
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Philip J. Hakeem;
Philip J. Hakeem
Center for High Technology Materials,
University of New Mexico
, Albuquerque, New Mexico 87106
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Steve R. J. Brueck;
Steve R. J. Brueck
Center for High Technology Materials,
University of New Mexico
, Albuquerque, New Mexico 87106
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Eungnak Han;
Eungnak Han
Department of Material Science and Engineering,
University of Wisconsin–Madison
, Madison, Wisconsin 53706
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Padma Gopalan
Padma Gopalan
Department of Material Science and Engineering,
University of Wisconsin–Madison
, Madison, Wisconsin 53706
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Chi-Chun Liu
Paul F. Nealey
a)
Alex K. Raub
Philip J. Hakeem
Steve R. J. Brueck
Eungnak Han
Padma Gopalan
Department of Chemical and Biological Engineering,
University of Wisconsin–Madison
, Madison, Wisconsin 53706a)
Author to whom correspondence should be addressed; electronic mail: [email protected]
J. Vac. Sci. Technol. B 28, C6B30–C6B34 (2010)
Article history
Received:
July 13 2010
Accepted:
September 07 2010
Citation
Chi-Chun Liu, Paul F. Nealey, Alex K. Raub, Philip J. Hakeem, Steve R. J. Brueck, Eungnak Han, Padma Gopalan; Integration of block copolymer directed assembly with 193 immersion lithography. J. Vac. Sci. Technol. B 1 November 2010; 28 (6): C6B30–C6B34. https://doi.org/10.1116/1.3501348
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