Moisture effect on electromigration characteristics for copper dual damascene interconnection Available to Purchase

The influence of moisture on Cu line electromigration (EM) behavior of dual damascene interconnection is reported. The authors have found that moisture has a negative influence on EM behavior, but it depends on the seal-ring structure located along the peripheral of the test pattern. The reduced Cu lifetime, observed for tested samples without seal-ring structure, was due to lateral moisture penetration. Lateral moisture diffusion was considered an effective mechanism for deteriorating the Cu interface during the die-sawing processing for structures without seal-ring layout. As a result, the seal-ring layout is effective and essential in Cu/low-dielectric (low-$k$⁠) material integrity to prevent moisture penetration during the package procedures.