We demonstrate that He can be a powerful tool to control B diffusion both in crystalline and preamorphized Si (PA-Si). By means of positron annihilation spectroscopy (PAS), we showed in He-implanted the formation after annealing of large open-volume defects at the implant projected range of He (voids) and of smaller vacancy-type defects toward the surface (nanovoids). In particular, these nanovoids locally suppress the amount of self-interstitials (Is) generated by B implantation, as verified by PAS, eventually reducing B diffusion and leading to a boxlike shape of the B-implanted profile. On the other hand, for B implantation in PA-Si, the authors demonstrated that if He-induced voids are formed between the end-of-range (EOR) defects and the surface, they act as a diffusion barrier for Is coming from the EOR defects. Indeed, this barrier strongly reduces diffusion of B placed in proximity of the surface.
Skip Nav Destination
Article navigation
January 2008
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
International Workshop on Insight in Semiconductor Device Fabrication, Metrology and Modeling (Insight 2007)
6-9 May 2007
Napa, California
Research Article|
January 31 2008
He implantation to control B diffusion in crystalline and preamorphized Si
E. Bruno;
E. Bruno
a)
MATIS CNR-INFM and Dipartimento di Fisica e Astronomia,
Università di Catania
, Via S. Sofia, I-95123 Catania, Italy
Search for other works by this author on:
S. Mirabella;
S. Mirabella
MATIS CNR-INFM and Dipartimento di Fisica e Astronomia,
Università di Catania
, Via S. Sofia, I-95123 Catania, Italy
Search for other works by this author on:
F. Priolo;
F. Priolo
MATIS CNR-INFM and Dipartimento di Fisica e Astronomia,
Università di Catania
, Via S. Sofia, I-95123 Catania, Italy
Search for other works by this author on:
K. Kuitunen;
K. Kuitunen
Laboratory of Physics,
Helsinki University of Technology
, P.O. Box 1100, FIN-02015 TKK Helsinki, Finland
Search for other works by this author on:
F. Tuomisto;
F. Tuomisto
Laboratory of Physics,
Helsinki University of Technology
, P.O. Box 1100, FIN-02015 TKK Helsinki, Finland
Search for other works by this author on:
J. Slotte;
J. Slotte
Laboratory of Physics,
Helsinki University of Technology
, P.O. Box 1100, FIN-02015 TKK Helsinki, Finland
Search for other works by this author on:
F. Giannazzo;
F. Giannazzo
CNR-IMM
, Sezione di Catania, Stradale Primosole 50, I-95121 Catania, Italy
Search for other works by this author on:
C. Bongiorno;
C. Bongiorno
CNR-IMM
, Sezione di Catania, Stradale Primosole 50, I-95121 Catania, Italy
Search for other works by this author on:
V. Raineri;
V. Raineri
CNR-IMM
, Sezione di Catania, Stradale Primosole 50, I-95121 Catania, Italy
Search for other works by this author on:
E. Napolitani
E. Napolitani
MATIS CNR-INFM and Dipartimento di Fisica,
Università di Padova
, Via Marzolo, 8, I-35131 Padova, Italy
Search for other works by this author on:
a)
Electronic mail: elena.bruno@ct.infn.it
J. Vac. Sci. Technol. B 26, 386–390 (2008)
Article history
Received:
May 31 2007
Accepted:
October 30 2007
Citation
E. Bruno, S. Mirabella, F. Priolo, K. Kuitunen, F. Tuomisto, J. Slotte, F. Giannazzo, C. Bongiorno, V. Raineri, E. Napolitani; He implantation to control B diffusion in crystalline and preamorphized Si. J. Vac. Sci. Technol. B 1 January 2008; 26 (1): 386–390. https://doi.org/10.1116/1.2816927
Download citation file:
Sign in
Don't already have an account? Register
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Pay-Per-View Access
$40.00
Citing articles via
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications
A. S. Stodolna, T. W. Mechielsen, et al.
High-efficiency metalenses for zone-plate-array lithography
Henry I. Smith, Mark Mondol, et al.