In order to reach the ITRS goals for future complementary metal-oxide semiconductor technologies, there is a growing need for the accurate extraction of ultrashallow electrically active dopant (carrier) profiles. In this work, it will be illustrated that this need can be met by the micro four-point probe (M4PP) tool. M4PP sheet resistance measurements taken along beveled Si and Ge blanket shallow structures will be investigated. From the differential sheet resistance changes, the underlying carrier profile can be reconstructed without the need to rely on a complicated contact modeling, i.e., M4PP carrier profiling is an absolute carrier depth profiling technique. On Si, it is found that the more sensitive a structure is to carrier spilling along the bevel, the better the M4PP system performs relative to conventional spreading resistance probe (SRP) due to its much lower probe pressure in combination with its sensitivity to what happens around the probes (and not underneath them). Also for Ge, the same issues change significantly the apparent carrier spilling behavior and improve the final accuracy obtained relative to SRP.
Skip Nav Destination
,
,
,
,
,
,
,
,
Article navigation
January 2008
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
International Workshop on Insight in Semiconductor Device Fabrication, Metrology and Modeling (Insight 2007)
6-9 May 2007
Napa, California
Research Article|
January 31 2008
Advanced carrier depth profiling on Si and Ge with micro four-point probe Available to Purchase
Trudo Clarysse;
Trudo Clarysse
a)
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium
Search for other works by this author on:
Pierre Eyben;
Pierre Eyben
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium
Search for other works by this author on:
Brigitte Parmentier;
Brigitte Parmentier
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium
Search for other works by this author on:
Benny Van Daele;
Benny Van Daele
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium
Search for other works by this author on:
Alessandra Satta;
Alessandra Satta
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium
Search for other works by this author on:
Wilfried Vandervorst;
Wilfried Vandervorst
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgium and Electrical Engineering Department, KU Leuven
, INSYS, Kasteelpark Arenberg 10, B-3001 Leuven, Belgium
Search for other works by this author on:
Rong Lin;
Rong Lin
CAPRES A/S,
Scion-DTU
, Building 373, DK-2800 Kongens Lyngby, Denmark
Search for other works by this author on:
Dirch Hjorth Petersen;
Dirch Hjorth Petersen
MIC-Department of Micro and Nanotechnology, NanoDTU,
Technical University of Denmark
, b-345 East, DK-2800 Kgs. Lyngby, Denmark and CAPRES A/S, Scion-DTU
, Building 373, DK-2800 Kongens Lyngby, Denmark
Search for other works by this author on:
Peter Folmer Nielsen
Peter Folmer Nielsen
CAPRES A/S,
Scion-DTU
, Building 373, DK-2800 Kongens Lyngby, Denmark
Search for other works by this author on:
Trudo Clarysse
a)
Pierre Eyben
Brigitte Parmentier
Benny Van Daele
Alessandra Satta
Wilfried Vandervorst
Rong Lin
Dirch Hjorth Petersen
Peter Folmer Nielsen
IMEC
, Kapeldreef 75, B-3001 Leuven, Belgiuma)
Electronic mail: [email protected]
J. Vac. Sci. Technol. B 26, 317–321 (2008)
Article history
Received:
May 31 2007
Accepted:
October 01 2007
Citation
Trudo Clarysse, Pierre Eyben, Brigitte Parmentier, Benny Van Daele, Alessandra Satta, Wilfried Vandervorst, Rong Lin, Dirch Hjorth Petersen, Peter Folmer Nielsen; Advanced carrier depth profiling on Si and Ge with micro four-point probe. J. Vac. Sci. Technol. B 1 January 2008; 26 (1): 317–321. https://doi.org/10.1116/1.2802101
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Science challenges and research opportunities for plasma applications in microelectronics
David B. Graves, Catherine B. Labelle, et al.
Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications
A. S. Stodolna, T. W. Mechielsen, et al.
Related Content
Photovoltage versus microprobe sheet resistance measurements on ultrashallow structures
J. Vac. Sci. Technol. B (March 2010)
Carrier spilling revisited: On-bevel junction behavior of different electrical depth profiling techniques
J. Vac. Sci. Technol. B (March 2003)
Impact of probe penetration on the electrical characterization of sub-50 nm profiles
J. Vac. Sci. Technol. B (January 2002)
Electrical characterization of InGaAs ultra-shallow junctions
J. Vac. Sci. Technol. B (March 2010)
Review of electrical characterization of ultra-shallow junctions with micro four-point probes
J. Vac. Sci. Technol. B (March 2010)