A thin-film coating system has been developed for the deposition of both conductive and insulating materials. The system employs a radio-frequency (rf)-discharge plasma source with four straight rf antennas, which is made of or covered with the deposition material, thus serving simultaneously as a sputtering target. The average deposition rate of the copper thin film can be as high as when operated under continuous-wave mode. Film properties under different operating conditions (gas pressure and rf power) have been investigated experimentally. Three thin-film coating schemes have been developed, one of which has been demonstrated to be suitable for conformal deep-trench coating. Conformal coating over trenches of high-aspect ratio has been demonstrated at both micron and submicron scales.
Conformal metal thin-film coatings in high-aspect-ratio trenches using a self-sputtered rf-driven plasma source
L. Ji, J.-K. Kim, Q. Ji, K.-N. Leung, Y. Chen, R. A. Gough; Conformal metal thin-film coatings in high-aspect-ratio trenches using a self-sputtered rf-driven plasma source. J. Vac. Sci. Technol. B 1 July 2007; 25 (4): 1227–1230. https://doi.org/10.1116/1.2749527
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