We report a novel microcolumn fabrication method using automated micro-electro-mechanical-systems (MEMS) assembly. Different microcolumn components, including deflectors, lens elements, and apertures, are fabricated on a highly doped thick silicon-on-insulator (SOI) wafer. These components with compliant connectors are then assembled onto compliant MEMS sockets fabricated on the same wafer using MEMS NanoEffectors™ and automated assembly. The self-aligning nature of MEMS sockets yields submicron lateral alignment and less than 0.1° angular misalignment. The measured resonant frequency is for first generation assembled components; the footprint of the microcolumn is less than . We have successfully built a mechanical prototype microcolumn for technology demonstration and as a proof of concept. Second generation design is under development.
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November 2004
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
The 48th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication
1-4 June 2004
San Diego, California (USA)
Research Article|
December 10 2004
Assembled micro-electromechanical-systems microcolumn from a single layer silicon process
R. Saini;
R. Saini
a)
Zyvex Corporation
, 1321 North Plano Road, Richardson, Texas 75081
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Z. Jandric;
Z. Jandric
Zyvex Corporation
, 1321 North Plano Road, Richardson, Texas 75081
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K. Tsui;
K. Tsui
Zyvex Corporation
, 1321 North Plano Road, Richardson, Texas 75081
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T. Udeshi;
T. Udeshi
Zyvex Corporation
, 1321 North Plano Road, Richardson, Texas 75081
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D. Tuggle
D. Tuggle
Portland State University
, Portland, Oregon 97207-0751
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R. Saini
a)
Z. Jandric
K. Tsui
T. Udeshi
D. Tuggle
Zyvex Corporation
, 1321 North Plano Road, Richardson, Texas 75081a)
Author to whom correspondence should be addressed; electronic mail: [email protected]
J. Vac. Sci. Technol. B 22, 3168–3173 (2004)
Article history
Received:
June 02 2004
Accepted:
September 21 2004
Citation
R. Saini, Z. Jandric, K. Tsui, T. Udeshi, D. Tuggle; Assembled micro-electromechanical-systems microcolumn from a single layer silicon process. J. Vac. Sci. Technol. B 1 November 2004; 22 (6): 3168–3173. https://doi.org/10.1116/1.1815311
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