Spindt-type field emitter arrays of tungsten microtips have been fabricated by optimizing aluminum parting layers. The aluminum parting layers, which play a crucial role in the subsequent deposition of peeling-free tungsten films, are characterized by varying the deposition conditions. The aluminum parting layer deposited at a high vacuum level has a good stress relaxation effect, and tungsten microtip field emitter arrays, free of peeling, are successfully fabricated and show good electrical characteristics.

Topics
Electrical properties and parameters, Field emitter arrays, Mechanical stress, Transition metals, Chemical elements
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