The Bayard–Alpert ionization gauge is one of the most commonly used gauges for the measurement and control of high and ultrahigh vacua (UHV). The electrons that ionize the residual gas are produced by a hot filament. The replacement of this source by field‐effect microtips would overcome many problems caused by thermoionic emission, such as degassing, high power consumption, and mechanical weakness. The results of the experiments involving the replacement of the tungsten filament by an array of microtips fabricated at LETI in a classical Bayard–Alpert gauge are presented. They show that microtips could be a good substitute for filaments in this application, and also they improve some characteristics such as the sensitivity of the gauge and the width of the working scale. Moreover, new options such as fast pulsed operation or fast security cutout modes are possible due to the very short time needed to stabilize the electronic emission. However, an improvement of the tip’s material is necessary if the gauge is intended to work continuously at pressures above 10−5 mbar.
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May 1996
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
The eighth international vacuum microelectronics conference
31 Jul − 3 Aug 1995
Portland, Oregon (USA)
Research Article|
May 01 1996
Bayard–Alpert vacuum gauge with microtips
R. Baptist;
R. Baptist
LETI‐CEA Technologies Avancées, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France
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C. Bieth;
C. Bieth
LETI‐CEA Technologies Avancées, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France
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C. Py
C. Py
LETI‐CEA Technologies Avancées, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France
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R. Baptist
C. Bieth
C. Py
LETI‐CEA Technologies Avancées, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France
J. Vac. Sci. Technol. B 14, 2119–2125 (1996)
Article history
Received:
August 03 1995
Accepted:
January 10 1996
Citation
R. Baptist, C. Bieth, C. Py; Bayard–Alpert vacuum gauge with microtips. J. Vac. Sci. Technol. B 1 May 1996; 14 (3): 2119–2125. https://doi.org/10.1116/1.588883
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