While progress in the microelectronics industry is gated by the frontiers of high technology and its underlying science, competitiveness in this industry is determined at least as much by how effectively the relevant science and engineering are integrated to address those issues central to manufacturing. Competitive manufacturing places a premium on such factors as rapid learning in technology development and yield enhancement, process and factory control, minimization of capital costs, and equipment and product reliability, all factors which synthesize the individual science and engineering elements associated with microelectronics technology. This paper is a primer for research aimed at impacting microelectronics manufacturing science and technology. After presenting an overview of competitiveness requirements for manufacturing, it focuses on strategic elements: advanced process equipment, process/materials characterization and real time process control, defect identification/control and reliability, three‐dimensional processing and manufacturability, and process integration.
Skip Nav Destination
Article navigation
July 1994
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
Research Article|
July 01 1994
Concepts in competitive microelectronics manufacturing Available to Purchase
Michael Liehr;
Michael Liehr
IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Search for other works by this author on:
Gary W. Rubloff
Gary W. Rubloff
IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Search for other works by this author on:
Michael Liehr
IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
Gary W. Rubloff
IBM T. J. Watson Research Center, P.O. Box 218, Yorktown Heights, New York 10598
J. Vac. Sci. Technol. B 12, 2727–2740 (1994)
Article history
Received:
January 24 1994
Accepted:
May 23 1994
Citation
Michael Liehr, Gary W. Rubloff; Concepts in competitive microelectronics manufacturing. J. Vac. Sci. Technol. B 1 July 1994; 12 (4): 2727–2740. https://doi.org/10.1116/1.587239
Download citation file:
Pay-Per-View Access
$40.00
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Citing articles via
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Transferable GeSn ribbon photodetectors for high-speed short-wave infrared photonic applications
Haochen Zhao, Suho Park, et al.
Heating of photocathode via field emission and radiofrequency pulsed heating: Implication toward breakdown
Ryo Shinohara, Soumendu Bagchi, et al.
Related Content
Microstructures and microelectronics
Physics Today (November 1979)
Microelectronic cooling using the Nottingham effect and internal field emission in a diamond (wide-band gap material) thin-film device
Appl. Phys. Lett. (October 1999)
Nanocharacterization Challenges in a Changing Microelectronics Landscape
AIP Conf. Proc. (November 2011)
Adhesive bonding in microelectronics and photonics
J. Appl. Phys. (May 2002)
Future of plasma etching for microelectronics: Challenges and opportunities
J. Vac. Sci. Technol. B (June 2024)