Microfabrication processes based on focused laser‐beam activation of surface chemistry are reviewed with an emphasis on the classification of the diverse chemical processes used. Surface reactions are divided according to their method of activation and the material phase most important in the chemical kinetics. Examples of reaction mechanisms and means of confining reaction dimensions are given. New results demonstrating that linewidths for deposition and etching of Si can be <0.4 μm are described. The ultimate limits to spatial resolution are explored in terms of an effective contrast (γ*) for laser–microchemical processes. Enhanced diffusive transport, characteristic of laser microreactions, and its effect on ultimate reaction rates are also analyzed.
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October 1983
This content was originally published in
Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena
Research Article|
October 01 1983
A review of laser–microchemical processing
D. J. Ehrlich;
D. J. Ehrlich
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–0073
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J. Y. Tsao
J. Y. Tsao
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173–0073
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J. Vac. Sci. Technol. B 1, 969–984 (1983)
Article history
Received:
June 03 1983
Accepted:
August 29 1983
Citation
D. J. Ehrlich, J. Y. Tsao; A review of laser–microchemical processing. J. Vac. Sci. Technol. B 1 October 1983; 1 (4): 969–984. https://doi.org/10.1116/1.582718
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