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Journal of Vacuum Science & Technology B covers microelectronics and nanometer structures with an emphasis on processing, measurement, and phenomena associated with micrometer, nanometer structures and devices and vacuum science and technology.
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Research Article
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August 30 2024
Anthony Ayari, Pascal Vincent et al.
The performance of field emitters is usually analyzed by linear fitting of a Fowler–Nordheim plot. It has sometimes been observed that the fitted slopes and intercepts show a strong correlation, but ...
Research Article
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August 06 2024
A. S. Stodolna, T. W. Mechielsen et al.
Inside extreme-ultraviolet (EUV) lithography machines, a hydrogen plasma is generated by ionization of the background gas by EUV photons. This plasma is essential for preventing carbon build-up on ...
Review Article
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June 07 2024
Gottlieb S. Oehrlein, Stephan M. Brandstadter et al.
Plasma etching is an essential semiconductor manufacturing technology required to enable the current microelectronics industry. Along with lithographic patterning, thin-film formation methods, and ...
Editor's Picks
Research Article
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August 20 2024
B. Claflin, G. J. Grzybowski et al.
GeSn films were simultaneously deposited on Si (100), Si (111), c-plane sapphire (Al2O3), and fused silica substrates to investigate the impact of the substrate on the resulting GeSn film. The ...
Research Article
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August 19 2024
Jian-Sian Li, Chao-Ching Chiang et al.
Co-60 gamma irradiation of SiC merged-PiN Schottky (MPS) diodes up to fluences of 1 Mrad (Si) produces increases in both forward and reverse current, with less damage when the devices are biased ...
Research Article
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August 02 2024
Carlo Scarcia, Giuseppe Bregliozzi et al.
Next-generation gravitational wave detectors (GWDs) like the Cosmic Explorer and Einstein Telescope require extensive vacuum tubing, necessitating cost-effective materials. This study explores the ...
Most Recent
Research Article
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September 04 2024
Vhahangwele Makumbane, M. Y. A. Yagoub et al.
As a potential upconverting layer for solar cell applications, the effect of substrate temperature on the structural, surface, and upconversion (UC) properties of Y2O3:Ho3+,Yb3+ thin films was ...
Research Article
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August 30 2024
Qi Wang, Kuibo Wang et al.
Particle-caused reticle defects contribute to a profound effect on the final integrated circuit (IC) yield, posing a significant technological challenge in extreme ultraviolet (EUV) lithography. This ...
Research Article
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August 30 2024
S. Kizawa, D. Bizen et al.
We present a chromatic deflection aberration-free beam-image-shifting technique for low-voltage scanning electron microscopy. The technique utilizes a Wien filter to correct the chromatic deflection ...
Future of plasma etching for microelectronics: Challenges and opportunities
Gottlieb S. Oehrlein, Stephan M. Brandstadter, et al.
Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications
A. S. Stodolna, T. W. Mechielsen, et al.
High-efficiency metalenses for zone-plate-array lithography
Henry I. Smith, Mark Mondol, et al.
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