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Issues
May 2005
ISSN 0734-2101
EISSN 1520-8559
In this Issue
CRITICAL REVIEWS
Comprehensive analysis of chlorine-containing capacitively coupled plasmas
J. Vac. Sci. Technol. A 23, 369–387 (2005)
https://doi.org/10.1116/1.1894725
ARTICLES
Removal of particles during plasma processes using a collector based on the properties of particles suspended in the plasma
J. Vac. Sci. Technol. A 23, 388–393 (2005)
https://doi.org/10.1116/1.1874134
Amorphous transparent conductive oxide films of -ZnO with additional impurities
J. Vac. Sci. Technol. A 23, 401–407 (2005)
https://doi.org/10.1116/1.1874172
Role of , , and ions in plasma discharges under active oxide etch conditions in an inductively coupled GEC cell reactor
J. Vac. Sci. Technol. A 23, 408–416 (2005)
https://doi.org/10.1116/1.1874173
Development of low temperature silicon oxide thin films by photo-CVD for surface passivation
J. Vac. Sci. Technol. A 23, 417–422 (2005)
https://doi.org/10.1116/1.1874174
Investigation of the nanostructure and wear properties of physical vapor deposited CrCuN nanocomposite coatings
J. Vac. Sci. Technol. A 23, 423–433 (2005)
https://doi.org/10.1116/1.1875212
Wettability and thermal stability of fluorocarbon films deposited by deep reactive ion etching
J. Vac. Sci. Technol. A 23, 434–439 (2005)
https://doi.org/10.1116/1.1875232
Discharge mode transitions in low-frequency inductively coupled plasmas with internal oscillating current sheets
J. Vac. Sci. Technol. A 23, 440–447 (2005)
https://doi.org/10.1116/1.1875252
Characterization of epitaxial germanium grown on ∕Si(111) using different surfactants
J. Vac. Sci. Technol. A 23, 448–451 (2005)
https://doi.org/10.1116/1.1875253
Effect of flow ratio on the microstructure and stress of room temperature reactively sputtered thin films
J. Vac. Sci. Technol. A 23, 452–459 (2005)
https://doi.org/10.1116/1.1875272
Using beam flux monitor as Langmuir probe for plasma-assisted molecular beam epitaxy
J. Vac. Sci. Technol. A 23, 460–464 (2005)
https://doi.org/10.1116/1.1881635
Enhancement of mechanical properties of organosilicon thin films deposited from diethylsilane
J. Vac. Sci. Technol. A 23, 465–469 (2005)
https://doi.org/10.1116/1.1881636
Adsorbate effects on pulsed electron diode anode thermal response
J. Vac. Sci. Technol. A 23, 470–474 (2005)
https://doi.org/10.1116/1.1887197
Effect of ion entry acceptance conditions on the performance of a quadrupole mass spectrometer operated in upper and lower stability regions
J. Vac. Sci. Technol. A 23, 480–487 (2005)
https://doi.org/10.1116/1.1894665
Plasma enhanced atomic layer deposition of and high-k thin films
J. Vac. Sci. Technol. A 23, 488–496 (2005)
https://doi.org/10.1116/1.1894666
X-ray photoelectron spectroscopic observation on B–C–N hybrids synthesized by ion beam deposition of borazine
J. Vac. Sci. Technol. A 23, 497–502 (2005)
https://doi.org/10.1116/1.1894667
Temperature dependence of resistivity of Si–Ta film deposited by magnetron sputtering
J. Vac. Sci. Technol. A 23, 503–505 (2005)
https://doi.org/10.1116/1.1894685
Anti-emission characteristics of the grid coated with hafnium film
J. Vac. Sci. Technol. A 23, 506–511 (2005)
https://doi.org/10.1116/1.1894726
Effects of substrate temperature on properties of pulsed dc reactively sputtered tantalum oxide films
J. Vac. Sci. Technol. A 23, 512–519 (2005)
https://doi.org/10.1116/1.1897700
Etching of oxynitride thin films using inductively coupled plasma
J. Vac. Sci. Technol. A 23, 520–524 (2005)
https://doi.org/10.1116/1.1897701
Surface and corrosion characteristics of carbon plasma implanted and deposited nickel-titanium alloy
J. Vac. Sci. Technol. A 23, 525–530 (2005)
https://doi.org/10.1116/1.1897702
Kind of oxide-composed superhard nanomultilayer prepared by magnetron sputtering
J. Vac. Sci. Technol. A 23, 539–544 (2005)
https://doi.org/10.1116/1.1901663
Characterization of a plasma produced by pulsed arc using an electrostatic double probe
J. Vac. Sci. Technol. A 23, 551–553 (2005)
https://doi.org/10.1116/1.1901666
Thermoelectric characterization of sputter-deposited bilayer thin films
J. Vac. Sci. Technol. A 23, 559–563 (2005)
https://doi.org/10.1116/1.1901671
Low temperature rf sputtering deposition of (Ba, Sr) thin film with crystallization enhancement by rf power supplied to the substrate
J. Vac. Sci. Technol. A 23, 564–569 (2005)
https://doi.org/10.1116/1.1901676
Method and setup for photodesorption measurements for a nonevaporable-getter-coated vacuum chamber
Oleg B. Malyshev; Vadim V. Anashin; Rodion V. Dostovalov; Nikita V. Fedorov; Alexander A. Krasnov; Ian R. Collins; Vladimir L. Ruzinov
J. Vac. Sci. Technol. A 23, 570–576 (2005)
https://doi.org/10.1116/1.1897705
SHOP NOTES
Summary: Update to ASTM guide E 1523 to charge control and charge referencing techniques in x-ray photoelectron spectroscopy
J. Vac. Sci. Technol. A 23, 577–578 (2005)
https://doi.org/10.1116/1.1901672
LETTERS
Batch process for atomic layer deposition of hafnium silicate thin films on 300-mm-diameter silicon substrates
J. Vac. Sci. Technol. A 23, L1–L3 (2005)
https://doi.org/10.1116/1.1887231
Low-resistivity molybdenum obtained by atomic layer deposition
Kees van der Zouw, Bernhard Y. van der Wel, et al.
Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride
Thorsten Lill, Mingmei Wang, et al.