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Issues
March 2001
ISSN 0734-2101
EISSN 1520-8559
In this Issue
ARTICLES
Epitaxial growth of thin films by pulsed laser deposition on GaAs(100) substrates
J. Vac. Sci. Technol. A 19, 391–393 (2001)
https://doi.org/10.1116/1.1339017
Waveguide structure of Er-doped films on different substrates by pulsed-laser deposition
J. Vac. Sci. Technol. A 19, 394–397 (2001)
https://doi.org/10.1116/1.1349197
Anisotropic etching of polymer films by high energy (∼100s of eV) oxygen atom neutral beams
J. Vac. Sci. Technol. A 19, 398–404 (2001)
https://doi.org/10.1116/1.1344909
Microstructure of Fe–N thin films prepared using an atomic nitrogen beam
J. Vac. Sci. Technol. A 19, 405–409 (2001)
https://doi.org/10.1116/1.1339016
Epitaxial growth of thin films on using ionized beam deposition
J. Vac. Sci. Technol. A 19, 410–413 (2001)
https://doi.org/10.1116/1.1349730
Properties of aluminum-doped zinc oxide films deposited by high rate mid-frequency reactive magnetron sputtering
J. Vac. Sci. Technol. A 19, 414–419 (2001)
https://doi.org/10.1116/1.1339019
Pulsed dc magnetron discharge for high-rate sputtering of thin films
J. Vac. Sci. Technol. A 19, 420–424 (2001)
https://doi.org/10.1116/1.1339018
Plasma enhanced direct current planar magnetron sputtering technique employing a twinned microwave electron cyclotron resonance plasma source
J. Vac. Sci. Technol. A 19, 425–428 (2001)
https://doi.org/10.1116/1.1340654
Frequency-dependent pulsed direct current magnetron sputtering of titanium oxide films
J. Vac. Sci. Technol. A 19, 429–434 (2001)
https://doi.org/10.1116/1.1351064
High-density plasma patterning of low dielectric constant polymers: A comparison between polytetrafluoroethylene, parylene-N, and poly(arylene ether)
T. E. F. M. Standaert; P. J. Matsuo; X. Li; G. S. Oehrlein; T.-M. Lu; R. Gutmann; C. T. Rosenmayer; J. W. Bartz; J. G. Langan; W. R. Entley
J. Vac. Sci. Technol. A 19, 435–446 (2001)
https://doi.org/10.1116/1.1349201
Study of surface chemical changes and erosion rates for CV-1144-O silicone under electron cyclotron resonance oxygen plasma exposure
J. Vac. Sci. Technol. A 19, 447–454 (2001)
https://doi.org/10.1116/1.1340652
Characterization of titanium nitride etch rate and selectivity to silicon dioxide in a helicon-wave plasma
J. Vac. Sci. Technol. A 19, 455–459 (2001)
https://doi.org/10.1116/1.1342866
Effects of gas-flow structures on radical and etch-product density distributions on wafers in magnetomicrowave plasma etching reactors
J. Vac. Sci. Technol. A 19, 460–466 (2001)
https://doi.org/10.1116/1.1349727
HBr concentration and temperature measurements in a plasma etch reactor using diode laser absorption spectroscopy
J. Vac. Sci. Technol. A 19, 477–484 (2001)
https://doi.org/10.1116/1.1342863
Electron cyclotron wave resonance plasma assisted deposition of cubic boron nitride thin films
J. Vac. Sci. Technol. A 19, 485–489 (2001)
https://doi.org/10.1116/1.1339007
Use of radio frequency bias in the large area plasma processing system
J. Vac. Sci. Technol. A 19, 490–498 (2001)
https://doi.org/10.1116/1.1347050
Comparison of pulsed laser deposition films grown from organic and inorganic targets
J. Vac. Sci. Technol. A 19, 499–502 (2001)
https://doi.org/10.1116/1.1344908
Influence of the different operations of gas in the large microwave plasmas
J. Vac. Sci. Technol. A 19, 503–506 (2001)
https://doi.org/10.1116/1.1351000
Fluorinated–chlorinated films prepared at low temperature by remote plasma-enhanced chemical-vapor deposition using mixtures of and
J. Vac. Sci. Technol. A 19, 507–514 (2001)
https://doi.org/10.1116/1.1349199
Microcrystalline silicon by plasma enhanced chemical vapor deposition from silicon tetrafluoride
J. Vac. Sci. Technol. A 19, 515–523 (2001)
https://doi.org/10.1116/1.1351004
Investigations of surface reactions during plasma etching of with equipment and feature scale models
J. Vac. Sci. Technol. A 19, 524–538 (2001)
https://doi.org/10.1116/1.1349728
Characteristics of a large diameter reactive ion beam generated by an electron cyclotron resonance microwave plasma source
J. Vac. Sci. Technol. A 19, 539–546 (2001)
https://doi.org/10.1116/1.1347051
Thermal imidization of fluorinated poly(amic acid) precursors on a glycidyl methacrylate graft-polymerized Si(100) surface
J. Vac. Sci. Technol. A 19, 547–556 (2001)
https://doi.org/10.1116/1.1340653
Characterization of (Ti, Al)N films deposited by off-plane double bend filtered cathodic vacuum arc
J. Vac. Sci. Technol. A 19, 557–562 (2001)
https://doi.org/10.1116/1.1351063
Adsorption of and initial stages of Ti growth on Si(001)
J. Vac. Sci. Technol. A 19, 563–567 (2001)
https://doi.org/10.1116/1.1351005
Negative cesium sputter ion source for generating cluster primary ion beams for secondary ion mass spectrometry analysis
J. Vac. Sci. Technol. A 19, 568–575 (2001)
https://doi.org/10.1116/1.1340651
Study of chromium oxide film growth by chemical vapor deposition using infrared reflection absorption spectroscopy
J. Vac. Sci. Technol. A 19, 576–583 (2001)
https://doi.org/10.1116/1.1339008
Real-time spectroscopic ellipsometry as a characterization tool for oxide molecular beam epitaxy
J. Vac. Sci. Technol. A 19, 584–590 (2001)
https://doi.org/10.1116/1.1351054
Energy spectra of electrons in a dc glow discharge with a semitransparent anode
J. Vac. Sci. Technol. A 19, 591–598 (2001)
https://doi.org/10.1116/1.1349200
Use of angle resolved x-ray photoelectron spectroscopy for determination of depth and thickness of compound layer structures
J. Vac. Sci. Technol. A 19, 603–608 (2001)
https://doi.org/10.1116/1.1344906
Microstructure and tribological performance of co-sputtered composites
J. Vac. Sci. Technol. A 19, 609–613 (2001)
https://doi.org/10.1116/1.1344907
Texture studies of thin films by x-ray diffraction and transmission electron microscopy
J. Vac. Sci. Technol. A 19, 614–620 (2001)
https://doi.org/10.1116/1.1342864
Real-time growth rate metrology for a tungsten chemical vapor deposition process by acoustic sensing
J. Vac. Sci. Technol. A 19, 621–626 (2001)
https://doi.org/10.1116/1.1340656
Microscopic composition difference related to oxidizing humidity near the ultrathin silicon oxide–Si(100) interface
J. Vac. Sci. Technol. A 19, 627–632 (2001)
https://doi.org/10.1116/1.1351065
Microstructural investigation of -epitaxially coated cemented carbide cutting tools
J. Vac. Sci. Technol. A 19, 633–639 (2001)
https://doi.org/10.1116/1.1349729
Mechanism of ultralow outgassing rates in pure copper and chromium–copper alloy vacuum chambers: Reexamination by the pressure-rise method
J. Vac. Sci. Technol. A 19, 640–645 (2001)
https://doi.org/10.1116/1.1339009
Study of a mechanically clamped cryo-chuck device in a high density plasma for deep anisotropic etching of silicon
J. Vac. Sci. Technol. A 19, 646–650 (2001)
https://doi.org/10.1116/1.1339014
Fixed-bed microreactor for transient kinetic experiments with strongly adsorbing gases under high vacuum conditions
J. Vac. Sci. Technol. A 19, 651–655 (2001)
https://doi.org/10.1116/1.1344910
Calibrated variable leak for use in ion source operation
J. Vac. Sci. Technol. A 19, 673–674 (2001)
https://doi.org/10.1116/1.1342867
Speed distribution of molecular beam scattered through chattering collision on a LiF(001) surface
J. Vac. Sci. Technol. A 19, 675–680 (2001)
https://doi.org/10.1116/1.1349731
Laser damage studies on thin films
Maria Lucia Protopapa; Ferdinando De Tomasi; Maria Rita Perrone; Angela Piegari; Enrico Masetti; Detlev Ristau; Etienne Quesnel; Angela Duparré
J. Vac. Sci. Technol. A 19, 681–688 (2001)
https://doi.org/10.1116/1.1347049
BRIEF REPORTS AND COMMENTS
Analysis of the molecular structure of fluorocarbon deposits produced by and plasmas
J. Vac. Sci. Technol. A 19, 689–692 (2001)
https://doi.org/10.1116/1.1349198
Reconsideration of the seal mechanism in the ConFlat® system
J. Vac. Sci. Technol. A 19, 693–696 (2001)
https://doi.org/10.1116/1.1349196
Gravity-related transport in reactive off-axis sputtering deposition?
J. Vac. Sci. Technol. A 19, 697–699 (2001)
https://doi.org/10.1116/1.1347052
Radio-frequency transient match monitoring using a fast Fourier transform for plasma diagnosis
J. Vac. Sci. Technol. A 19, 700–702 (2001)
https://doi.org/10.1116/1.1349195
RAPID COMMUNICATIONS
SHOP NOTES
Silicon bonding for ultrahigh vaccuum surface science studies
J. Vac. Sci. Technol. A 19, 706–708 (2001)
https://doi.org/10.1116/1.1350997
Gas-phase etching mechanism of silicon oxide by a mixture of hydrogen fluoride and ammonium fluoride: A density functional theory study
Romel Hidayat, Khabib Khumaini, et al.
High throughput multiplexing reactor design for rapid screening of atomic/molecular layer deposition processes
Yuri Choe, Duncan Reece, et al.
Many routes to ferroelectric HfO2: A review of current deposition methods
Hanan Alexandra Hsain, Younghwan Lee, et al.