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Issues
September 1999
ISSN 0734-2101
EISSN 1520-8559
REVIEW ARTICLE
The search for novel, superhard materials
J. Vac. Sci. Technol. A 17, 2401–2420 (1999)
https://doi.org/10.1116/1.581977
REGULAR ARTICLES
Consequences of mode structure on plasma properties in electron cyclotron resonance sources
J. Vac. Sci. Technol. A 17, 2421–2430 (1999)
https://doi.org/10.1116/1.581978
Silicon etching in remote microwave plasmas
J. Vac. Sci. Technol. A 17, 2431–2437 (1999)
https://doi.org/10.1116/1.581979
Mass spectrometric measurements on inductively coupled fluorocarbon plasmas: Positive ions, radicals and endpoint detection
Xi Li; Marc Schaepkens; Gottlieb S. Oehrlein; Robert E. Ellefson; Louis C. Frees; Norbert Mueller; Norman Korner
J. Vac. Sci. Technol. A 17, 2438–2446 (1999)
https://doi.org/10.1116/1.581980
Mass spectrometric detection of reactive neutral species: Beam-to-background ratio
J. Vac. Sci. Technol. A 17, 2447–2455 (1999)
https://doi.org/10.1116/1.581981
Investigation of 4% carbon in hydrogen electron cyclotron resonance microwave plasmas using ethane as the source gas
J. Vac. Sci. Technol. A 17, 2456–2462 (1999)
https://doi.org/10.1116/1.581982
Reactive ion etching of piezoelectric in a plasma
J. Vac. Sci. Technol. A 17, 2467–2469 (1999)
https://doi.org/10.1116/1.581984
Experimental investigation of the respective roles of oxygen atoms and electrons in the deposition of in /TEOS helicon plasmas
J. Vac. Sci. Technol. A 17, 2470–2474 (1999)
https://doi.org/10.1116/1.581985
Pulsed and continuous wave plasma deposition of amorphous, hydrogenated silicon carbide from plasmas
J. Vac. Sci. Technol. A 17, 2475–2484 (1999)
https://doi.org/10.1116/1.582105
Analytical modeling of silicon etch process in high density plasma
Shahram Abdollahi-Alibeik; James P. McVittie; Krishna C. Saraswat; Valeriy Sukharev; Philippe Schoenborn
J. Vac. Sci. Technol. A 17, 2485–2491 (1999)
https://doi.org/10.1116/1.581986
Selective etching of over polycrystalline silicon using in an inductively coupled plasma reactor
J. Vac. Sci. Technol. A 17, 2492–2502 (1999)
https://doi.org/10.1116/1.581987
Reactive ion etching for mesa structuring in HgCdTe
J. Vac. Sci. Technol. A 17, 2503–2509 (1999)
https://doi.org/10.1116/1.581988
Two-dimensional CT images of two-frequency capacitively coupled plasma
J. Vac. Sci. Technol. A 17, 2510–2516 (1999)
https://doi.org/10.1116/1.581989
Mechanism of fluorine reduction in parallel-plate-type electron-cyclotron-resonance plasma by a Si top plate
J. Vac. Sci. Technol. A 17, 2517–2524 (1999)
https://doi.org/10.1116/1.581990
Characterization and enhanced properties of plasma immersion ion processed diamond-like carbon films
J. Vac. Sci. Technol. A 17, 2525–2530 (1999)
https://doi.org/10.1116/1.581991
Investigations of different dry etching methods on
J. Vac. Sci. Technol. A 17, 2531–2534 (1999)
https://doi.org/10.1116/1.581992
Very uniform and high aspect ratio anisotropy etching process in magnetic neutral loop discharge plasma
J. Vac. Sci. Technol. A 17, 2546–2550 (1999)
https://doi.org/10.1116/1.581995
New radical control method for high-performance dielectric etching with nonperfluorocompound gas chemistries in ultrahigh-frequency plasma
J. Vac. Sci. Technol. A 17, 2551–2556 (1999)
https://doi.org/10.1116/1.581996
Mechanism of dissociation in parallel-plate-type plasma
Hisataka Hayashi; Satoshi Morishita; Tetsuya Tatsumi; Yukinobu Hikosaka; Shuichi Noda; Hideo Nakagawa; Shoji Kobayashi; Masami Inoue; Tyuji Hoshino
J. Vac. Sci. Technol. A 17, 2557–2571 (1999)
https://doi.org/10.1116/1.581997
Operating high-density plasma sources in a low-density range: Applications to metal etch processes
J. Vac. Sci. Technol. A 17, 2572–2580 (1999)
https://doi.org/10.1116/1.581998
Etching polyimide with a nonequilibrium atmospheric-pressure plasma jet
J. Vac. Sci. Technol. A 17, 2581–2585 (1999)
https://doi.org/10.1116/1.581999
Fourier-transform infrared measurements of discharges in an electron cyclotron resonance reactor
J. Vac. Sci. Technol. A 17, 2586–2592 (1999)
https://doi.org/10.1116/1.582000
Characterizing metal-masked silica etch process in a inductively coupled plasma
J. Vac. Sci. Technol. A 17, 2593–2597 (1999)
https://doi.org/10.1116/1.581917
Microscopic modeling of InP etching in plasma
J. Vac. Sci. Technol. A 17, 2598–2606 (1999)
https://doi.org/10.1116/1.581918
Hydrogenated amorphous carbon nitride films on Si(100) deposited by direct current saddle-field plasma-enhanced chemical vapor deposition
J. Vac. Sci. Technol. A 17, 2607–2611 (1999)
https://doi.org/10.1116/1.581919
Silicon nitride films deposited at substrate temperatures <100 °C in a permanent magnet electron cyclotron resonance plasma
J. Vac. Sci. Technol. A 17, 2612–2618 (1999)
https://doi.org/10.1116/1.582103
Stoichiometry dependency of the firing and sustain voltage properties of MgO thin films for alternating current plasma display panels
J. Vac. Sci. Technol. A 17, 2619–2622 (1999)
https://doi.org/10.1116/1.581920
Development and characterization of surface chemistries for microfabricated biosensors
J. Vac. Sci. Technol. A 17, 2623–2628 (1999)
https://doi.org/10.1116/1.581921
Oxynitridation of cubic silicon carbide (100) surfaces
J. Vac. Sci. Technol. A 17, 2629–2633 (1999)
https://doi.org/10.1116/1.581922
Novel reflectron time of flight analyzer for surface analysis using secondary ion mass spectroscopy and mass spectroscopy of recoiled ions
J. Vac. Sci. Technol. A 17, 2634–2641 (1999)
https://doi.org/10.1116/1.581923
Density-functional cluster study of K adsorption on GaAs(110) surface
J. Vac. Sci. Technol. A 17, 2647–2654 (1999)
https://doi.org/10.1116/1.581925
Composition and structure of HCl-isopropanol treated and vacuum annealed GaAs(100) surfaces
J. Vac. Sci. Technol. A 17, 2655–2662 (1999)
https://doi.org/10.1116/1.581926
Analysis of P adsorption and desorption on the (001) InP surface using surface photoabsorption
J. Vac. Sci. Technol. A 17, 2663–2667 (1999)
https://doi.org/10.1116/1.581927
Cryogenic stabilization of high vapor pressure samples for surface analysis under ultrahigh vacuum conditions
J. Vac. Sci. Technol. A 17, 2668–2675 (1999)
https://doi.org/10.1116/1.581928
Atomic flux measurement by diode-laser-based atomic absorption spectroscopy
J. Vac. Sci. Technol. A 17, 2676–2684 (1999)
https://doi.org/10.1116/1.581929
Interface morphology of CdS thin films grown on cadmium stannate and glass substrates studied by grazing incidence x-ray scattering
J. Vac. Sci. Technol. A 17, 2685–2691 (1999)
https://doi.org/10.1116/1.581930
Low energy cathodoluminescence spectroscopy of etched 6H-SiC surfaces
J. Vac. Sci. Technol. A 17, 2692–2695 (1999)
https://doi.org/10.1116/1.581931
Sorption properties and temperature-dependent near-surface chemistry of the intermetallic compound
J. Vac. Sci. Technol. A 17, 2696–2702 (1999)
https://doi.org/10.1116/1.581932
Spatially resolved fluorine actinometry
J. Vac. Sci. Technol. A 17, 2703–2708 (1999)
https://doi.org/10.1116/1.581933
Computer study of boron segregation at the Si(100)– and Si(111)– surfaces
J. Vac. Sci. Technol. A 17, 2709–2712 (1999)
https://doi.org/10.1116/1.581934
Carbon impurity characterization on a linear plasma device using visible emission spectroscopy
J. Vac. Sci. Technol. A 17, 2713–2718 (1999)
https://doi.org/10.1116/1.581935
Oxygen-induced changes in electron-energy-loss spectra for Al, Be and Ni
J. Vac. Sci. Technol. A 17, 2719–2730 (1999)
https://doi.org/10.1116/1.581936
Investigation of slider surfaces after wear using photoemission electron microscopy
J. Vac. Sci. Technol. A 17, 2731–2736 (1999)
https://doi.org/10.1116/1.581937
Enhanced secondary electron yield from oxidized regions on amorphous carbon films studied by x-ray spectromicroscopy
J. Vac. Sci. Technol. A 17, 2737–2740 (1999)
https://doi.org/10.1116/1.581938
Thickness determination of metal thin films with spectroscopic ellipsometry for x-ray mirror and multilayer applications
J. Vac. Sci. Technol. A 17, 2741–2748 (1999)
https://doi.org/10.1116/1.581939
Preferred orientation in carbon and boron nitride: Does a thermodynamic theory of elastic strain energy get it right?
J. Vac. Sci. Technol. A 17, 2749–2752 (1999)
https://doi.org/10.1116/1.581940
Effects of moisture on Fowler–Nordheim characterization of thin silicon-oxide films
Charles A. Peterson; Richard K. Workman; Dror Sarid; Bert Vermeire; Harold G. Parks; Dennis Adderton; Peter Maivald
J. Vac. Sci. Technol. A 17, 2753–2758 (1999)
https://doi.org/10.1116/1.581941
Molecular dynamics simulations of impacts onto a chlorinated silicon surface: Energies and angles of the reflected and Cl fragments
J. Vac. Sci. Technol. A 17, 2759–2770 (1999)
https://doi.org/10.1116/1.581942
X-ray photoelectron spectroscopy study of bombardment-induced compositional changes in , , and
J. Vac. Sci. Technol. A 17, 2771–2778 (1999)
https://doi.org/10.1116/1.581943
Electronic structure, depth profile, and complex impedance spectroscopy of Pd doped ZnO ultrafine particle films
J. Vac. Sci. Technol. A 17, 2779–2784 (1999)
https://doi.org/10.1116/1.581944
Temperature programmed desorption from graphite
D. Schleussner; D. Rösler; J. Becker; W. Knapp; Ch. Edelmann; C. Garcı́a-Rosales; P. Franzen; R. Behrisch
J. Vac. Sci. Technol. A 17, 2785–2790 (1999)
https://doi.org/10.1116/1.581945
Negative ion resputtering in thin films
J. Vac. Sci. Technol. A 17, 2805–2810 (1999)
https://doi.org/10.1116/1.581947
Effects of thermal annealing on the microstructure and mechanical properties of carbon–nitrogen films deposited by radio frequency-magnetron sputtering
J. Vac. Sci. Technol. A 17, 2811–2818 (1999)
https://doi.org/10.1116/1.582021
Molecular dynamics simulation of Cu and Ar ion sputtering of Cu (111) surfaces
J. Vac. Sci. Technol. A 17, 2819–2825 (1999)
https://doi.org/10.1116/1.581948
High-rate deposition of biaxially textured yttria-stabilized zirconia by dual magnetron oblique sputtering
J. Vac. Sci. Technol. A 17, 2826–2829 (1999)
https://doi.org/10.1116/1.581949
Particle growth in a sputtering discharge
J. Vac. Sci. Technol. A 17, 2835–2840 (1999)
https://doi.org/10.1116/1.581951
Establishing the relationship between process, structure, and properties of TiN films deposited by electron cyclotron resonance assisted reactive sputtering. I. Variations in hardness and roughness as a function of process parameters
J. Vac. Sci. Technol. A 17, 2850–2858 (1999)
https://doi.org/10.1116/1.581952
Instabilities of the reactive sputtering process involving one metallic target and two reactive gases
J. Vac. Sci. Technol. A 17, 2869–2878 (1999)
https://doi.org/10.1116/1.581953
Influence of the sputtering variables in the ion bombardment during off-axis deposition of films
J. Vac. Sci. Technol. A 17, 2879–2884 (1999)
https://doi.org/10.1116/1.581954
High performance Al–N cermet solar coatings deposited by a cylindrical direct current magnetron sputter coater
J. Vac. Sci. Technol. A 17, 2885–2890 (1999)
https://doi.org/10.1116/1.581955
Microstructure modification of silver films deposited by ionized magnetron sputter deposition
J. Vac. Sci. Technol. A 17, 2891–2895 (1999)
https://doi.org/10.1116/1.581956
Energy transfer into the growing film during sputter deposition: An investigation by calorimetric measurements and Monte Carlo simulations
J. Vac. Sci. Technol. A 17, 2896–2905 (1999)
https://doi.org/10.1116/1.581957
Optical constants of crystalline deposited by magnetron sputtering
Michael J. DeVries; Chris Trimble; Thomas E. Tiwald; Daniel W. Thompson; John A. Woollam; Jeffrey S. Hale
J. Vac. Sci. Technol. A 17, 2906–2910 (1999)
https://doi.org/10.1116/1.581958
Synthesis of hard TiN coatings with suppressed columnar growth and reduced stress
J. Vac. Sci. Technol. A 17, 2915–2919 (1999)
https://doi.org/10.1116/1.581960
Interdiffusion studies of single crystal TiN/NbN superlattice thin films
J. Vac. Sci. Technol. A 17, 2920–2927 (1999)
https://doi.org/10.1116/1.581961
Vacuum deposited biaxial thin films with all principal axes inclined to the substrate
J. Vac. Sci. Technol. A 17, 2928–2932 (1999)
https://doi.org/10.1116/1.581962
Visible and infrared photochromic properties of amorphous films
J. Vac. Sci. Technol. A 17, 2933–2938 (1999)
https://doi.org/10.1116/1.581963
Ferroelectric properties of thin films deposited on annealed and Ir bottom electrodes
J. Vac. Sci. Technol. A 17, 2939–2943 (1999)
https://doi.org/10.1116/1.581964
Dual ion beam deposited boron-rich boron nitride films
J. Vac. Sci. Technol. A 17, 2944–2949 (1999)
https://doi.org/10.1116/1.581965
Processing and characterization of nanometer sized copper sulfide particles
J. Vac. Sci. Technol. A 17, 2950–2956 (1999)
https://doi.org/10.1116/1.581966
Ex situ growth of the c-axis preferred oriented thin films on substrates
J. Vac. Sci. Technol. A 17, 2957–2961 (1999)
https://doi.org/10.1116/1.581967
Integration of fluorinated amorphous carbon as low-dielectric constant insulator: Effects of heating and deposition of tantalum nitride
J. Vac. Sci. Technol. A 17, 2969–2974 (1999)
https://doi.org/10.1116/1.581968
Precise, scalable shadow mask patterning of vacuum-deposited organic light emitting devices
J. Vac. Sci. Technol. A 17, 2975–2981 (1999)
https://doi.org/10.1116/1.581969
Butanethiol on Au{100}-(5×20) using a simple retractable doser
J. Vac. Sci. Technol. A 17, 2982–2986 (1999)
https://doi.org/10.1116/1.581970
Bi/Sb superlattices grown by molecular beam epitaxy
J. Vac. Sci. Technol. A 17, 2987–2990 (1999)
https://doi.org/10.1116/1.581971
Effects of grid bias on heteroepitaxy
J. Vac. Sci. Technol. A 17, 3003–3007 (1999)
https://doi.org/10.1116/1.581973
Self-limiting growth conditions on (001) InP by alternate triethylindium and tertiarybutylphosphine supply in ultrahigh vacuum
J. Vac. Sci. Technol. A 17, 3008–3018 (1999)
https://doi.org/10.1116/1.581974
Growth kinetics of GaN and effects of flux ratio on the properties of GaN films grown by plasma-assisted molecular beam epitaxy
J. Vac. Sci. Technol. A 17, 3019–3028 (1999)
https://doi.org/10.1116/1.581975
Residual stress in GaN films grown by metalorganic chemical vapor deposition
J. Vac. Sci. Technol. A 17, 3029–3032 (1999)
https://doi.org/10.1116/1.581976
Metalorganic chemical vapor deposition of barium strontium titanate thin films with a more coordinatively saturated Ti precursor,
J. Vac. Sci. Technol. A 17, 3033–3037 (1999)
https://doi.org/10.1116/1.582001
Improved GaN growth using a quasihot wall metal-organic chemical vapor epitaxy reactor
J. Vac. Sci. Technol. A 17, 3038–3044 (1999)
https://doi.org/10.1116/1.582002
Giant enhancement of magneto-optical response and increase in perpendicular magnetic anisotropy of ultrathin Co/Pt(111) films upon thermal annealing
J. Vac. Sci. Technol. A 17, 3045–3050 (1999)
https://doi.org/10.1116/1.582003
Parametrization of Laframboise’s results for spherical and cylindrical Langmuir probes
J. Vac. Sci. Technol. A 17, 3051–3056 (1999)
https://doi.org/10.1116/1.582004
Versatile and economical specimen heater for ultrahigh vacuum applications
J. Vac. Sci. Technol. A 17, 3057–3061 (1999)
https://doi.org/10.1116/1.582005
Influence of an electrical field on the macroparticle size distribution in a vacuum arc
J. Vac. Sci. Technol. A 17, 3067–3073 (1999)
https://doi.org/10.1116/1.582007
Mechanism of enhanced plasma transport of vacuum arc plasma through curved magnetic ducts
J. Vac. Sci. Technol. A 17, 3074–3076 (1999)
https://doi.org/10.1116/1.582008
Recommended practices for measuring the performance and characteristics of closed-loop gaseous helium cryopumps
Kimo M. Welch; Bruce Andeen; Johan E. de Rijke; Christopher A. Foster; Marsbed H. Hablanian; Ralph C. Longsworth; William E. Millikin, Jr.; Y. Tito Sasaki; Constantinos Tzemos
J. Vac. Sci. Technol. A 17, 3081–3095 (1999)
https://doi.org/10.1116/1.582023
Entrapment pump: Noble gas pump for use in combination with a getter pump
J. Vac. Sci. Technol. A 17, 3103–3107 (1999)
https://doi.org/10.1116/1.582011
BRIEF REPORTS AND COMMENTS
Electric degradation behavior of hot filament in diamond chemical vapor deposition
J. Vac. Sci. Technol. A 17, 3108–3110 (1999)
https://doi.org/10.1116/1.582029
RAPID COMMUNICATIONS
Epitaxial growth of ferrite films by pulsed laser deposition
J. Vac. Sci. Technol. A 17, 3111–3114 (1999)
https://doi.org/10.1116/1.582012
Chemical vapor deposition of barium strontium titanate films using a single mixture of metalorganic precursors
J. Vac. Sci. Technol. A 17, 3115–3117 (1999)
https://doi.org/10.1116/1.582024
SHOP NOTES
Measuring the magnetic field distribution of a magnetron sputtering target
J. Vac. Sci. Technol. A 17, 3118–3120 (1999)
https://doi.org/10.1116/1.582013
Video-game controller joystick
J. Vac. Sci. Technol. A 17, 3121–3122 (1999)
https://doi.org/10.1116/1.582014
PAPERS FROM THE AVS - ULTRA CLEAN SOCIETY SESSION
Influence of wafer’s back-surface finish on dry-etching characteristics
J. Vac. Sci. Technol. A 17, 3125–3128 (1999)
https://doi.org/10.1116/1.582015
Silicon nitride film growth for advanced gate dielectric at low temperature employing high-density and low-energy ion bombardment
J. Vac. Sci. Technol. A 17, 3129–3133 (1999)
https://doi.org/10.1116/1.582016
Low-temperature large-grain poly-Si direct deposition by microwave plasma enhanced chemical vapor deposition using
J. Vac. Sci. Technol. A 17, 3134–3138 (1999)
https://doi.org/10.1116/1.582017
Clean aluminum oxide formation on surface of aluminum cylinder in an ultraclean gas-sampling system
J. Vac. Sci. Technol. A 17, 3139–3143 (1999)
https://doi.org/10.1116/1.582018
Gas-phase etching mechanism of silicon oxide by a mixture of hydrogen fluoride and ammonium fluoride: A density functional theory study
Romel Hidayat, Khabib Khumaini, et al.
High throughput multiplexing reactor design for rapid screening of atomic/molecular layer deposition processes
Yuri Choe, Duncan Reece, et al.
Many routes to ferroelectric HfO2: A review of current deposition methods
Hanan Alexandra Hsain, Younghwan Lee, et al.