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Photon emission at metal/solution interface induced by electron injection from solvated electrons
J. Vac. Sci. Technol. A 10, 2981–2984 (1992)
https://doi.org/10.1116/1.577896
Comparison of Cu(111) in aqueous electrolytes and in ultrahigh vacuum: An optical second harmonic generation study
J. Vac. Sci. Technol. A 10, 2985–2990 (1992)
https://doi.org/10.1116/1.577897
X‐ray photoelectron spectroscopy study on the electrical double layer at an Al2O3–Al interface
J. Vac. Sci. Technol. A 10, 2991–2995 (1992)
https://doi.org/10.1116/1.577898
Observation of electronic structure at the metal/electrolyte and metal/vacuum interface by second‐harmonic generation
J. Vac. Sci. Technol. A 10, 2996–3000 (1992)
https://doi.org/10.1116/1.577899
Electrochemical and in situ atomic force microscopy and scanning tunneling microscopy investigations of titanium in oxalic acid solution
J. Vac. Sci. Technol. A 10, 3001–3006 (1992)
https://doi.org/10.1116/1.577856
Influence of adsorbed and implanted sulfur on the corrosion of iron in calcium nitrate at 60 °C
J. Vac. Sci. Technol. A 10, 3007–3011 (1992)
https://doi.org/10.1116/1.577857
Copper adlayer formation on Au(111) from sulfuric acid electrolyte
J. Vac. Sci. Technol. A 10, 3012–3018 (1992)
https://doi.org/10.1116/1.577858
Surface x‐ray diffraction study of the Au(111) electrode in 0.01 M NaCl: Electrochemically induced surface reconstruction
J. Vac. Sci. Technol. A 10, 3019–3025 (1992)
https://doi.org/10.1116/1.577859
H2O adsorption on Ni(s) (111) surfaces: Evidence for a step induced influence on the adsorption geometry
J. Vac. Sci. Technol. A 10, 3026–3031 (1992)
https://doi.org/10.1116/1.577860
X‐ray photoemission study of SF6/O2 triode reactive ion etching of polycrystalline silicon, silicon dioxide, and their interface
J. Vac. Sci. Technol. A 10, 3039–3047 (1992)
https://doi.org/10.1116/1.577862
Dual excitation reactive ion etcher for low energy plasma processing
J. Vac. Sci. Technol. A 10, 3048–3054 (1992)
https://doi.org/10.1116/1.577863
Microwave plasma enhanced chemical vapor deposition in magnetic fields below electron cyclotron resonance
J. Vac. Sci. Technol. A 10, 3055–3059 (1992)
https://doi.org/10.1116/1.577864
Reactive ion etching of poly(tetrafluoroethylene) in O2–CF4 plasmas
J. Vac. Sci. Technol. A 10, 3060–3064 (1992)
https://doi.org/10.1116/1.577865
Effect of the radio‐frequency voltage phase in a balanced triode plasma etching reactor
J. Vac. Sci. Technol. A 10, 3070–3075 (1992)
https://doi.org/10.1116/1.577867
Study of W/Ti triode plasma etching
J. Vac. Sci. Technol. A 10, 3076–3085 (1992)
https://doi.org/10.1116/1.577868
Energy‐resolved angular distributions of O+ ions at the radio‐frequency‐powered electrode in reactive ion etching
J. Vac. Sci. Technol. A 10, 3086–3091 (1992)
https://doi.org/10.1116/1.577869
Etching of silicon in low‐pressure plasmas containing fluorine and oxygen: A comparison of real‐time and postplasma surface studies
J. Vac. Sci. Technol. A 10, 3092–3099 (1992)
https://doi.org/10.1116/1.577870
Characterization of a radio frequency plasma source for molecular beam epitaxial growth of high‐Tc superconductor films
J. Vac. Sci. Technol. A 10, 3100–3103 (1992)
https://doi.org/10.1116/1.577871
Contamination by sputtering in mirror field electron cyclotron resonance microwave plasma sources
J. Vac. Sci. Technol. A 10, 3104–3113 (1992)
https://doi.org/10.1116/1.577872
Doppler shift measurements of ion energy distribution widths in an electron cyclotron resonance/multipole hybrid reactor
J. Vac. Sci. Technol. A 10, 3114–3118 (1992)
https://doi.org/10.1116/1.577873
Langmuir probe and optical emission studies of Ar, O2, and N2 plasmas produced by an electron cyclotron resonance microwave source
J. Vac. Sci. Technol. A 10, 3119–3124 (1992)
https://doi.org/10.1116/1.577874
Electrical characteristics of plasma‐deposited diamondlike carbon/silicon metal–insulator–semiconductor structures
J. Vac. Sci. Technol. A 10, 3125–3130 (1992)
https://doi.org/10.1116/1.577875
Growth characteristics of photolytic laser‐induced chemical vapor deposition of tungsten from WF6
J. Vac. Sci. Technol. A 10, 3131–3135 (1992)
https://doi.org/10.1116/1.577876
Temperature distribution in an ideal azimuthally symmetric chemical‐vapor‐deposition reactor
J. Vac. Sci. Technol. A 10, 3136–3142 (1992)
https://doi.org/10.1116/1.577877
Quantitative correlation of infrared absorption with nuclear magnetic resonance measurements of hydrogen content in diamond films
J. Vac. Sci. Technol. A 10, 3143–3148 (1992)
https://doi.org/10.1116/1.577834
X‐ray photoelectron spectroscopy study of polymer surface reactions in F2 and O2 gases and plasmas
J. Vac. Sci. Technol. A 10, 3149–3157 (1992)
https://doi.org/10.1116/1.577835
X‐ray photoemission spectroscopy studies of cesium and oxygen on GaAs(100)
J. Vac. Sci. Technol. A 10, 3158–3165 (1992)
https://doi.org/10.1116/1.577836
Effects of different pretreatments on the surface structure of silicon and the adhesion of metal films
J. Vac. Sci. Technol. A 10, 3166–3170 (1992)
https://doi.org/10.1116/1.577837
Ultraviolet ozone oxidation of Si surface studied by photoemission and surface infrared spectroscopy
J. Vac. Sci. Technol. A 10, 3171–3175 (1992)
https://doi.org/10.1116/1.577838
In situ photoreflectance study of Schottky barrier formation in InP(110)
J. Vac. Sci. Technol. A 10, 3176–3178 (1992)
https://doi.org/10.1116/1.577839
Differential method for measuring coverage‐dependent adsorption probabilities
J. Vac. Sci. Technol. A 10, 3179–3183 (1992)
https://doi.org/10.1116/1.577840
Nulling optical bridge for nonintrusive temperature measurements
J. Vac. Sci. Technol. A 10, 3184–3192 (1992)
https://doi.org/10.1116/1.577841
Heat transport in cold‐wall single‐wafer low pressure chemical‐vapor‐deposition reactors
J. Vac. Sci. Technol. A 10, 3193–3202 (1992)
https://doi.org/10.1116/1.577842
Resistivity measurements of thin film iridium on silicon
J. Vac. Sci. Technol. A 10, 3203–3206 (1992)
https://doi.org/10.1116/1.577843
Structural properties of Y2O3 stabilized ZrO2 films deposited by reactive thermal coevaporation
J. Vac. Sci. Technol. A 10, 3207–3209 (1992)
https://doi.org/10.1116/1.577844
Sputtered neutrals mass spectrometry of organic molecules using multiphoton postionization
J. Vac. Sci. Technol. A 10, 3210–3215 (1992)
https://doi.org/10.1116/1.577845
Temperature programmed desorption mass spectrometry of organic matrix compounds
J. Vac. Sci. Technol. A 10, 3216–3220 (1992)
https://doi.org/10.1116/1.577846
Molecular‐beam experiment for adsorption kinetics and catalytic reactions studies
J. Vac. Sci. Technol. A 10, 3221–3228 (1992)
https://doi.org/10.1116/1.577847
Design considerations for high‐flux collisionally opaque molecular beams
J. Vac. Sci. Technol. A 10, 3229–3238 (1992)
https://doi.org/10.1116/1.577848
Ion sputter effects on HgTe, CdTe, and HgCdTe
J. Vac. Sci. Technol. A 10, 3239–3245 (1992)
https://doi.org/10.1116/1.577849
Comparison of ion‐implantation‐induced damage in narrow‐gap (0.1 eV) Hg1−xCdxTe and Hg1−xZnxTe
J. Vac. Sci. Technol. A 10, 3246–3252 (1992)
https://doi.org/10.1116/1.577850
Rutile‐type TiO2 formation by ion beam dynamic mixing
J. Vac. Sci. Technol. A 10, 3253–3259 (1992)
https://doi.org/10.1116/1.577851
Variation of the lead content in sputtered copper–lead films due to resputtering effects
J. Vac. Sci. Technol. A 10, 3260–3265 (1992)
https://doi.org/10.1116/1.577852
Thin films from energetic cluster impact: A feasibility study
J. Vac. Sci. Technol. A 10, 3266–3271 (1992)
https://doi.org/10.1116/1.577853
Study on direct current reactive sputtering deposition of aluminum nitride thin films
J. Vac. Sci. Technol. A 10, 3272–3277 (1992)
https://doi.org/10.1116/1.577854
Stress and microhardness in sputter deposited molybdenum and chromium films
J. Vac. Sci. Technol. A 10, 3278–3282 (1992)
https://doi.org/10.1116/1.577855
Use of an externally applied axial magnetic field to control ion/neutral flux ratios incident at the substrate during magnetron sputter deposition
J. Vac. Sci. Technol. A 10, 3283–3287 (1992)
https://doi.org/10.1116/1.577812
Effects of target presputtering on stoichiometry of sputtered Bi–Sr–Ca–Cu–O thin films
J. Vac. Sci. Technol. A 10, 3288–3291 (1992)
https://doi.org/10.1116/1.577813
Cluster formation in the vapor produced by laser pulsing of the Y1Ba2Cu3O7 superconducting solid
J. Vac. Sci. Technol. A 10, 3292–3299 (1992)
https://doi.org/10.1116/1.577814
High reflectivity dielectric mirror deposition by reactive magnetron sputtering
J. Vac. Sci. Technol. A 10, 3305–3311 (1992)
https://doi.org/10.1116/1.577816
Highly reflective x‐ray mirror
J. Vac. Sci. Technol. A 10, 3312–3317 (1992)
https://doi.org/10.1116/1.577817
Low resistivity body‐centered cubic tantalum thin films as diffusion barriers between copper and silicon
J. Vac. Sci. Technol. A 10, 3318–3321 (1992)
https://doi.org/10.1116/1.577818
1/f noise in Bi2Sr2Ca2Cu3–O and its impact on bolometer performance
J. Vac. Sci. Technol. A 10, 3322–3324 (1992)
https://doi.org/10.1116/1.577819
Ag segregation and epitaxial Cr growth on Ag(100)
J. Vac. Sci. Technol. A 10, 3325–3332 (1992)
https://doi.org/10.1116/1.577820
Ion spectroscopy gauge: Total pressure measurements down to 10−12 Pa with discrimination against electron‐stimulated‐desorption ions
J. Vac. Sci. Technol. A 10, 3333–3339 (1992)
https://doi.org/10.1116/1.577821
Pumping characteristics of sputter ion pumps with high‐magnetic‐flux densities in an ultrahigh‐vacuum range
J. Vac. Sci. Technol. A 10, 3340–3343 (1992)
https://doi.org/10.1116/1.577822
Pumping performance of a new type of hybrid molecular pump
J. Vac. Sci. Technol. A 10, 3352–3355 (1992)
https://doi.org/10.1116/1.577824
Kinetics of morphological change during annealing of amorphous yttria
J. Vac. Sci. Technol. A 10, 3356–3358 (1992)
https://doi.org/10.1116/1.577825
Potassium Auger emission by K+ ion bombardment of Ag surface
J. Vac. Sci. Technol. A 10, 3359–3361 (1992)
https://doi.org/10.1116/1.577826
Cyclic annealing‐induced microstructural and crystallographic changes in crystalline yttria films on silica
J. Vac. Sci. Technol. A 10, 3362–3364 (1992)
https://doi.org/10.1116/1.577827
Growth of sodium clusters at the surface of Na β″‐alumina crystals induced by electron bombardment
J. Vac. Sci. Technol. A 10, 3365–3367 (1992)
https://doi.org/10.1116/1.577828
Uniformity of targets erosion and magnetic film thickness distribution in the target‐facing‐type sputtering method
J. Vac. Sci. Technol. A 10, 3371–3375 (1992)
https://doi.org/10.1116/1.577830
Utilizing a portable cycle purge nitrogen venturi for removal of process gases in semiconductor processing gas systems
J. Vac. Sci. Technol. A 10, 3376–3377 (1992)
https://doi.org/10.1116/1.577831
Errors in curve fitting of profilometer data
J. Vac. Sci. Technol. A 10, 3378–3382 (1992)
https://doi.org/10.1116/1.577832
Erratum: ‘‘Imaging monolayer structure by means of Auger electrons’’ [J. Vac. Sci. Technol. A 10, 158 (1992)]
J. Vac. Sci. Technol. A 10, 3383 (1992)
https://doi.org/10.1116/1.577833