This article describes a very reliable method of securely banding electrical leads to the circumference of a substrate for ultrahigh vacuum applications in which mechanical support and/or electrical insulation are necessary. Its minimal increase to the overall diameter of the substrate (low profile) makes it very convenient to use in confined places.
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Letter| September 01 1987
Reliable, low‐profile banding of electrical leads in high‐vacuum systems
G. L. Fowler; Reliable, low‐profile banding of electrical leads in high‐vacuum systems. J. Vac. Sci. Technol. A 1 September 1987; 5 (5): 2978. https://doi.org/10.1116/1.574240
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