A thermal atomic layer deposition process with precursors tris(trimethylsilyl) phosphate (TTMSP), titanium tetrachloride (TiCl4), and water was used with various pulse sequences in order to deposit titanium phosphate onto bundles of carbon fibers (diameter of one filament = 7 μm, 6000 filaments per bundle) and flat silicon substrates. Pulse sequence 1, TTMSP/N2/TiCl4/N2, which comprises no water, yields no significant deposition. Pulse sequence 2, TTMSP/N2/H2O/N2/TiCl4/N2, which comprises a water pulse, yields a mixed phosphate/oxide coating and shows a self-limiting character at 200 °C with a growth per cycle of 0.22 nm cycle−1. Wet chemical analysis of the coating revealed a ratio of Ti:P between 3:1 and 2:1 in reasonable agreement with the composition Ti2.4P1O7 obtained from X-ray photoelectron spectroscopy. Thus, the deposited material can approximately be described as a mixture of Ti¾PO4 and TiO2 in a molar ratio of 1:1.5. The coating shifts the temperature of the onset of oxidation—3% weight loss in thermogravimetry—of the carbon fibers from 630 °C (uncoated C-fiber) to 750 °C (with the titanium phosphate coating).
Skip Nav Destination
Article navigation
March 2022
Research Article|
January 27 2022
Atomic layer deposition of titanium phosphate onto reinforcing fibers using titanium tetrachloride, water, and tris(trimethylsilyl) phosphate as precursors
Special Collection:
Atomic Layer Deposition (ALD)
Pauline Dill
;
Pauline Dill
a)
1
Physical Chemistry, Institute of Chemistry, Chemnitz University of Technology
, Straße der Nationen 62, 09111 Chemnitz, Germany
a)Author to whom correspondence should be addressed: pauline.dill@chemie.tu-chemnitz.de
Search for other works by this author on:
Xiang Ren
;
Xiang Ren
1
Physical Chemistry, Institute of Chemistry, Chemnitz University of Technology
, Straße der Nationen 62, 09111 Chemnitz, Germany
Search for other works by this author on:
Helen Hintersatz;
Helen Hintersatz
1
Physical Chemistry, Institute of Chemistry, Chemnitz University of Technology
, Straße der Nationen 62, 09111 Chemnitz, Germany
Search for other works by this author on:
Mathias Franz
;
Mathias Franz
2
Fraunhofer Institute for Electronic Nano Systems ENAS
, Technologie-Campus 3, 09126 Chemnitz, Germany
Search for other works by this author on:
Doreen Dentel;
Doreen Dentel
3
Analysis of Solid Surfaces, Institute of Physics, Chemnitz University of Technology
, Reichenhainer Straße 70, 09126 Chemnitz, Germany
Search for other works by this author on:
Christoph Tegenkamp
;
Christoph Tegenkamp
3
Analysis of Solid Surfaces, Institute of Physics, Chemnitz University of Technology
, Reichenhainer Straße 70, 09126 Chemnitz, Germany
Search for other works by this author on:
Susann Ebert
Susann Ebert
1
Physical Chemistry, Institute of Chemistry, Chemnitz University of Technology
, Straße der Nationen 62, 09111 Chemnitz, Germany
Search for other works by this author on:
a)Author to whom correspondence should be addressed: pauline.dill@chemie.tu-chemnitz.de
Note: This paper is part of the 2022 Special Topic Collection on Atomic Layer Deposition (ALD).
J. Vac. Sci. Technol. A 40, 022403 (2022)
Article history
Received:
September 29 2021
Accepted:
December 14 2021
Citation
Pauline Dill, Xiang Ren, Helen Hintersatz, Mathias Franz, Doreen Dentel, Christoph Tegenkamp, Susann Ebert; Atomic layer deposition of titanium phosphate onto reinforcing fibers using titanium tetrachloride, water, and tris(trimethylsilyl) phosphate as precursors. J. Vac. Sci. Technol. A 1 March 2022; 40 (2): 022403. https://doi.org/10.1116/6.0001514
Download citation file:
Sign in
Don't already have an account? Register
Sign In
You could not be signed in. Please check your credentials and make sure you have an active account and try again.
Pay-Per-View Access
$40.00
Citing articles via
Gas-phase etching mechanism of silicon oxide by a mixture of hydrogen fluoride and ammonium fluoride: A density functional theory study
Romel Hidayat, Khabib Khumaini, et al.
Low-resistivity molybdenum obtained by atomic layer deposition
Kees van der Zouw, Bernhard Y. van der Wel, et al.