This review discusses critical aspects of patterning phase change materials (PCMs), including dry etching, wet clean, and encapsulation, as they dictate the reliability and functionality of the phase change random access memory devices. Specifically, alloys of germanium–antimony–tellurium are used as a model system, and the importance of PCM composition control, critical dimension control, high fidelity pattern transfer, and a system level of ambient control to avoid oxidation that can alter the materials’ functionality are highlighted. The research findings motivate the development of a state-of-the-art integrated system that combines dry etch, wet clean, and encapsulation into one platform to realize consistent and successful patterning of PCMs for future generations of the memory devices.
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