The growth of large (20 mm diam by 50 mm length) Hg1−xCdxTe crystals by incremental quenching of large volume Hg1−xCdxTe alloy melts was demonstrated. This method is based on the sequential freezing of shallow melts that have large surface to volume ratios onto a large diameter growing ingot. The resulting homogeneous polycrystalline ingots were annealed at 665 °C to promote grain growth. Grain sizes ranging from 25 to 35 mm were obtained after annealing at 665 °C for 28 days. In addition, the crystals showed very little substructure and had dislocation densities of 1.25±0.6×105 cm2. Hall effect measurements on wafers annealed at temperatures below 300 °C show an n‐type behavior with carrier concentrations ranging from 3.3×1014 to 4.8×1014 cm3 and majority carrier mobilities ranging from 1.69×105 to 2.29×105 cm2/V s at 77 K for a composition x=0.225. The compositional variation Δx in the radial and axial direction was measured by several techniques and was found to range from 0.005 to 0.01.

This content is only available via PDF.
You do not currently have access to this content.