The uncontrolled formation of an interfacial layer between high- oxides and semiconductors is a major concern in advanced microelectronics not only for Si-based devices but also for those exploiting the higher mobility of Ge and GaAs. Using transmission electron microscopy, the authors investigate the interfacial layer formed between as-grown thin films, deposited using atomic layer deposition, and oxide free Si(100), Ge(100), and GaAs(100). In particular, they compare the effects of two different oxygen sources ( and ) on interfacial layer formation during the growth process. They show that no interfacial layer can be distinguished unambiguously between the films, grown using TMA and or , and all the semiconductor substrates.
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