This study demonstrates that the surface tension of plating solutions should be optimized to achieve a compromise between the gap-filling capability of copper electroplating and the formation of copper-void defects. The plating solution with lower surface tension has better gap filling but generates more air bubbles during copper electroplating. For a low-surface-tension electrolyte, the improvement in the gap-filling capability is caused by the enhancement in the ability of fluids to wet high-aspect-ratio features, whereas the increase in the formation of copper-void defects results from more air bubbles generated during the electroplating process. This study provides a model to describe the role of surface tension in copper electroplating.
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Research Article|
April 20 2007
Role of surface tension in copper electroplating
Shih-Chieh Chang;
Shih-Chieh Chang
Department of Material Science,
National University of Tainan
, Tainan, Taiwan, and Department of Applied Physics, National Chiayi University, Chia-Yi, Taiwan
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Ying-Lang Wang;
Ying-Lang Wang
a)
Department of Material Science,
National University of Tainan
, Tainan, Taiwan, and Department of Applied Physics, National Chiayi University, Chia-Yi, Taiwan
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Chi-Cheng Hung;
Chi-Cheng Hung
Department of Electrical Engineering,
National Cheng Kung University
, Tainan 701, Taiwan
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Wen-His Lee;
Wen-His Lee
Department of Electrical Engineering,
National Cheng Kung University
, Tainan 701, Taiwan
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Gwo-Jen Hwang
Gwo-Jen Hwang
College of Science and Engineering,
National University of Tainan
, Tainan, Taiwan
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a)
Author to whom correspondence should be addressed; electronic mail: [email protected]
J. Vac. Sci. Technol. A 25, 566–569 (2007)
Article history
Received:
September 19 2006
Accepted:
March 26 2007
Citation
Shih-Chieh Chang, Ying-Lang Wang, Chi-Cheng Hung, Wen-His Lee, Gwo-Jen Hwang; Role of surface tension in copper electroplating. J. Vac. Sci. Technol. A 1 May 2007; 25 (3): 566–569. https://doi.org/10.1116/1.2731354
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