A low energy (1.45kJ) dense plasma focus device is used to deposit thin films of aluminum nitride (AlN) at room temperature on silicon substrates. For deposition of films, a conventional hollow copper anode is replaced with a solid aluminum anode and nitrogen is used as fill gas. The films are deposited using a multiple number of focus shots by placing the substrate in front of the anode. The deposited films are characterized using x-ray diffraction (XRD), Raman spectroscopy, scanning electron microscopy, and a microhardness test. The XRD analysis of the films shows that the deposited films show strong c-axis alignment. The Raman spectra of the films indicate that the deposited films are under compressive stress and crystalline quality decreases with increasing number of focus shots. The microhardness results point toward the uniform deposition of hard AlN layers on silicon substrates.

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