In this study, silicon oxynitride (SiON) has been etched in a inductively coupled plasma. The process parameters examined include a radio frequency source power, bias power, pressure, and flow rate. For process optimization, a statistical experimental design was employed to investigate parameter effects under various plasma conditions. The etch rate increased almost linearly with increasing the source or bias power. Main effect analysis revealed that the etch rate is dominated by the source power. The flow rate exerted the least impact on both etch rate and profile angle. It was estimated that the effect is transparent only as the etchant is supplied sufficiently. Depending on the pressure levels, the etch rate varied in a complicated way. Parameter effects on the profile angle were very small and the profile angle varied between 83° and 87° for all etching experiments. In nearly all experiments, microtrenching was observed. The etch rate and profile angle, optimized at source power, bias power, pressure, and flow rate, are and 86°, respectively.
Skip Nav Destination
Research Article| April 21 2005
Etching of oxynitride thin films using inductively coupled plasma
Nam Jung Kim;
Byungwhan Kim, Dukwoo Lee, Nam Jung Kim, Byung Teak Lee; Etching of oxynitride thin films using inductively coupled plasma. J. Vac. Sci. Technol. A 1 May 2005; 23 (3): 520–524. https://doi.org/10.1116/1.1897701
Download citation file: