A molecular ion of (trimethylvinylsilane)(1,1,1,5,5,5-hexafluoroacetyl-acetonato)Cu(I) [Cu(hfac)(tmvs)], which could not be detected by mass spectrometry with conventional ionization techniques such as electron impact ionization because of weak coordination bonds, has been successfully detected as a quasimolecular ion, Cu(hfac)(tmvs), for the first time by recently developed ion-attachment mass spectrometry (IAMS). Cu(hfac)(tmvs) is a material widely used in the metal organic chemical vapor deposition (MOCVD) process. In the thermal decomposition of Cu(hfac)(tmvs), trimethylvinylsilane (tmvs) and hexafluoroacetylacetone (Hhfac) were observed by IAMS as the reaction products. We also evaluated the dependence of the decomposition process on temperature. We found IAMS to be an effective tool in monitoring and clarifying MOCVD processes.
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November 2004
Research Article|
October 20 2004
Detection of quasimolecular ion of Cu(hfac)(tmvs) by ion attachment mass spectrometry
Megumi Nakamura;
Megumi Nakamura
a)
ANELVA Technix Corporation
, Yotsuya, Fuchu, Tokyo 183-8508, Japan
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Yoshiro Shiokawa;
Yoshiro Shiokawa
ANELVA Technix Corporation
, Yotsuya, Fuchu, Tokyo 183-8508, Japan
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Toshihiro Fujii;
Toshihiro Fujii
ANELVA Technix Corporation
, Yotsuya, Fuchu, Tokyo 183-8508, Japan
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Masao Takayanagi;
Masao Takayanagi
Faculty of Agriculture
, Tokyo University of Agriculture and Technology, 3-5-8, Saiwai-cho, Fuchu, Tokyo 183-8509, Japan
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Munetaka Nakata
Munetaka Nakata
Graduate School of BASE (Bio-Applications and Systems Engineering)
, Tokyo University of Agriculture and Technology, 2-24-16, Naka-cho, Koganei, Tokyo 184-8588, Japan
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a)
Author to whom correspondence should be addressed; electronic mail: [email protected]
J. Vac. Sci. Technol. A 22, 2347–2350 (2004)
Article history
Received:
February 12 2004
Accepted:
August 02 2004
Citation
Megumi Nakamura, Yoshiro Shiokawa, Toshihiro Fujii, Masao Takayanagi, Munetaka Nakata; Detection of quasimolecular ion of Cu(hfac)(tmvs) by ion attachment mass spectrometry. J. Vac. Sci. Technol. A 1 November 2004; 22 (6): 2347–2350. https://doi.org/10.1116/1.1798751
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