The structural characteristics of films along with the interfacial layers deposited on partially strain compensated heterostructure have been investigated using x-ray diffraction (XRD), high resolution transmission electron microscopy (TEM), time-of-flight secondary ion mass spectroscopy (SIMS), and x-ray photoelectron spectroscopy (XPS) measurements. XRD spectra show the films to be polycrystalline with both monoclinic and tetragonal phases. The film with physical thickness of ∼8.5 nm and an amorphous interfacial layer with a physical thickness of ∼3.6 nm have been observed by high resolution TEM, SIMS and XPS. SIMS and XPS analyses show the formation of an amorphous Zr–germano–silicate interfacial layer between the deposited oxide and SiGeC films. The electrical properties in terms of capacitance–voltage conductance–voltage, current density–voltage, and gate voltage shift under a constant current stressing have been studied using a metal–insulator–semiconductor (MIS) structure. A dielectric constant of 17.5 for and 7.0 for interfacial Zr–Ge–silicate layer have been calculated from the high frequency characteristics. These dielectrics show an equivalent oxide thickness (EOT) as low as 1.9 nm for and 2.0 nm for the interfacial silicate layer. The MIS capacitor shows an extremely low leakage current density of at a gate voltage of −1.0 V, breakdown field of 7 MV/cm based on EOT as the length scale, and moderate interface state density of for with interfacial layer. The Zr–Ge–silicate interfacial layer separately shows a low leakage current density of at of −1 V and of Significant improvements in the charge trapping properties under Fowler–Nordheim constant current stressing in both with the interfacial layer and Zr–Ge–silicate layers have been observed.
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September 2003
Research Article|
August 19 2003
Structural and electrical characteristics of the interfacial layer of ultrathin films on partially strain compensated layers
R. Mahapatra;
R. Mahapatra
Department of Physics and Meteorology, IIT, Kharagpur 721 302, India
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S. Maikap;
S. Maikap
Center for Microstructure Science of Materials, School of Materials Science and Engineering, Seoul National University, Seoul 151-742, South Korea
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Je-Hun Lee;
Je-Hun Lee
Center for Microstructure Science of Materials, School of Materials Science and Engineering, Seoul National University, Seoul 151-742, South Korea
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G. S. Kar;
G. S. Kar
Department of Physics and Meteorology, IIT, Kharagpur 721 302, India
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A. Dhar;
A. Dhar
Department of Physics and Meteorology, IIT, Kharagpur 721 302, India
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Doh-Y. Kim;
Doh-Y. Kim
Center for Microstructure Science of Materials, School of Materials Science and Engineering, Seoul National University, Seoul 151-742, South Korea
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D. Bhattacharya;
D. Bhattacharya
Materials Science Center, IIT, Kharagpur 721 302, India
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S. K. Ray
S. K. Ray
Department of Physics and Meteorology, IIT, Kharagpur 721 302, India
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R. Mahapatra
S. Maikap
Je-Hun Lee
G. S. Kar
A. Dhar
Doh-Y. Kim
D. Bhattacharya
S. K. Ray
Department of Physics and Meteorology, IIT, Kharagpur 721 302, India
J. Vac. Sci. Technol. A 21, 1758–1764 (2003)
Article history
Received:
December 16 2002
Accepted:
June 30 2003
Citation
R. Mahapatra, S. Maikap, Je-Hun Lee, G. S. Kar, A. Dhar, Doh-Y. Kim, D. Bhattacharya, S. K. Ray; Structural and electrical characteristics of the interfacial layer of ultrathin films on partially strain compensated layers. J. Vac. Sci. Technol. A 1 September 2003; 21 (5): 1758–1764. https://doi.org/10.1116/1.1603279
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