The use of plasma source ion implantation (PSII) for impurity sensitive substrates such as semiconductors has been slow to be adopted due to the difficulty of producing low impurity plasmas. In this work the feasibility of producing impurity‐free plasmas for PSII using a mass filtering technique is investigated. In this method, an ion cyclotron resonance (ICR) cell is incorporated into a plasma processing reactor to selectively expel unwanted ions. The implementation of ICR in ion implantation is subject to a number of complications, such as ion–neutral collisions, plasma shielding of excitation fields, and nonhomogeneities of the magnetic field. A numerical simulation of ICR‐based mass filtering for PSII to investigate these effects has been developed. Mass filtering is potentially effective over a wide range of magnetic field configurations at the pressures typically used for PSII.
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July 1994
The 40th National Symposium of the American Vacuum Society
15−19 Nov 1993
Orlando, Florida (USA)
Research Article|
July 01 1994
Computer simulation of mass‐selective plasma‐source ion implantation
J. L. Shohet;
J. L. Shohet
Engineering Research Center for Plasma‐Aided Manufacturing, University of Wisconsin, Madison, Wisconsin 53706
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E. B. Wickesberg;
E. B. Wickesberg
Engineering Research Center for Plasma‐Aided Manufacturing, University of Wisconsin, Madison, Wisconsin 53706
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Mark J. Kushner
Mark J. Kushner
Department of Electrical and Computer Engineering, University of Illinois, Urbana, Illinois 61801
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J. Vac. Sci. Technol. A 12, 1380–1386 (1994)
Article history
Received:
October 11 1993
Accepted:
April 04 1994
Citation
J. L. Shohet, E. B. Wickesberg, Mark J. Kushner; Computer simulation of mass‐selective plasma‐source ion implantation. J. Vac. Sci. Technol. A 1 July 1994; 12 (4): 1380–1386. https://doi.org/10.1116/1.579325
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