Adhesion between polycarbonate substrate and SiO₂ film formed from silane and nitrous oxide by plasma‐enhanced chemical vapor deposition Available to Purchase

We studied the adhesion of a silicon dioxide film, formed from silane and nitrous oxide gas by plasma‐enhanced chemical vapor deposition, to a polycarbonate substrate and the bonding between the film and the substrate by x‐ray photoelectron spectroscopy. Adhesion of the SiO₂ film to the polycarbonate increases with increasing SiH₄ flow rate. All SiO₂ film squares produced at a SiH₄ flow rate of 10 standard cm³ min⁻¹ exhibited good adhesion to the substrate. An analysis of the x‐ray photoelectron spectra indicates that more phenyl groups are decomposed as adhesion increases. The bonding between the SiO₂ film and the polycarbonate substrate is discussed on the basis of x‐ray photoelectron spectroscopy. The Si–O–C bonding between SiO₂ and polycarbonate results in good adhesion between the film and the substrate.