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Journal of Vacuum Science & Technology A Cover Image for Volume 43, Issue 3
Current Issue
Volume 43,
Issue 3,
May 2025

Focus and Coverage

Journal of Vacuum Science & Technology A has a scope that is focused on the understanding of interfaces and surfaces at a fundamental level and to advance state-of-the-art technological applications of surface science and thin film materials science.

Read more about the journal

Editor's Picks
Research Article
Junji Kataoka, Norikatsu Sasao et al.
In the high-aspect-ratio hole etching process, there is a strong need for high selectivity of SiO2 and SiN films against the amorphous carbon mask. To meet this demand, we conducted research on the ...
Research Article
Jianming Guo, Zhiping Mou et al.
Three-dimensional plasma etching profile evolution remains a fundamental challenge in semiconductor process engineering, especially given its complexity and computational cost. In this work, we ...
Research Article
Alaina Humiston, Miu Lun Lau et al.
We have developed an artificial intelligence tool, XES Neo, for fitting x-ray emission spectroscopy (XES) data using a genetic algorithm. The Neo package has been applied to extended x-ray absorption ...
Most Recent
Research Article
Lingyu Meng, Dong Su Yu et al.
Background carbon incorporation and film cracking issue in (001) β-Ga2O3 films grown by metalorganic chemical vapor deposition (MOCVD) are investigated. Quantitative secondary ion mass spectrometry ...
Research Article
Y. G. Li, G. Z. Ouyang et al.
This study investigates the behavior of plasma discharge and particle transport in Modulated Pulsed Power Magnetron Sputtered Cr targets by introducing helium (He), an inert gas with the highest ...
Research Article
Yi Chen, Daniel Cho et al.
The selective etching of Si1−xGex over Si enables the fabrication of the gate-all-around field-effect transistors. While ample experimental data have confirmed such selectivity in various ...

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