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Journal Articles

Effect of Triton X-100 surfactant and agitation on tetramethylammonium hydroxide wet etching for microneedle fabrication

Yu He, Wenhan Hu, Bo Cui
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 053002 (2024)
https://doi.org/10.1116/6.0003852
Published: September 2024
View article titled, Effect of Triton X-100 surfactant and agitation on tetramethylammonium hydroxide wet etching for microneedle fabrication
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Journal Articles

Radio frequency side-gate nanoscale vacuum channel triode

Zhihua Shen, Qiaoning Li, Bin Ge, Xiao Wang, Shengli Wu
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 052801 (2024)
https://doi.org/10.1116/6.0003823
Published: August 2024
View article titled, Radio frequency side-gate nanoscale vacuum channel triode
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Journal Articles

Dynamic switching operation of diamond MOSFETs with NO2 p-type doping and Al2O3 gate insulation and passivation

Niloy Chandra Saha, Tomoki Shiratsuchi, Masanori Eguchi, Toshiyuki Oishi, Makoto Kasu
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 052207 (2024)
https://doi.org/10.1116/5.0218780
Published: August 2024
View article titled, Dynamic switching operation of diamond MOSFETs with NO<sub>2</sub> p-type doping and Al<sub>2</sub>O<sub>3</sub> gate insulation and passivation
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Journal Articles

Fabrication of hollow silicon microneedles using grayscale lithography and deep reactive ion etching

Dong Zhang, Wenhan Hu, Bo Cui
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 053001 (2024)
https://doi.org/10.1116/6.0003711
Published: August 2024
View article titled, Fabrication of hollow silicon microneedles using grayscale lithography and deep reactive ion etching
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Journal Articles

Roughness-generation mechanism of Ru etching using Cl2/O2-based plasma for advanced interconnect

Miyako Matsui, Yohei Ishii, Lucas Kovatch, Kathryn Maier, Masaya Imai, Makoto Miura, Kenichi Kuwahara
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 042208 (2024)
https://doi.org/10.1116/6.0003736
Published: July 2024
View article titled, Roughness-generation mechanism of Ru etching using Cl<sub>2</sub>/O<sub>2</sub>-based plasma for advanced interconnect
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Journal Articles

Matrices to enhance the ion yield of OLED molecules in ToF-SIMS: An interesting alchemist solution

Pierre Hirchenhahn, Claire Guyot, Christelle Laugier, Tony Maindron, Benoît Gilquin, Greg Fisher, Jean-Paul Barnes
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 044003 (2024)
https://doi.org/10.1116/6.0003648
Published: June 2024
View article titled, Matrices to enhance the ion yield of OLED molecules in ToF-SIMS: An interesting alchemist solution
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Journal Articles

Performance enhancement in spin transfer torque magnetic random access memory through in situ cap layer optimization

Zhenghui Ji, Yongzhao Peng, Guoxiu Qiu, Guchang Han, Qijun Guo
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 043801 (2024)
https://doi.org/10.1116/6.0003661
Published: June 2024
View article titled, Performance enhancement in spin transfer torque magnetic random access memory through <em>in situ</em> cap layer optimization
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Journal Articles

Numerical analysis of high vacuum packaging efficiency for narrow structured devices

Zhengwei Mei, Siwei Wang, Wenyu Lin, Xudi Wang, Yuqing Wang
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 044202 (2024)
https://doi.org/10.1116/6.0003641
Published: June 2024
View article titled, Numerical analysis of high vacuum packaging efficiency for narrow structured devices
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Journal Articles

Cu1−xAlx films as alternatives to copper for advanced interconnect metallization

Jean-Philippe Soulié, Kiroubanand Sankaran, Geoffrey Pourtois, Johan Swerts, Zsolt Tőkei, Christoph Adelmann
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 043203 (2024)
https://doi.org/10.1116/6.0003634
Published: June 2024
View article titled, Cu<sub>1−x</sub>Al<sub>x</sub> films as alternatives to copper for advanced interconnect metallization
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Journal Articles

Future of plasma etching for microelectronics: Challenges and opportunities

Featured
Gottlieb S. Oehrlein, Stephan M. Brandstadter, Robert L. Bruce, Jane P. Chang, Jessica C. DeMott, Vincent M. Donnelly, Rémi Dussart, Andreas Fischer, Richard A. Gottscho, Satoshi Hamaguchi, Masanobu Honda, Masaru Hori, Kenji Ishikawa, Steven G. Jaloviar, Keren J. Kanarik, Kazuhiro Karahashi, Akiteru Ko, Hiten Kothari, Nobuyuki Kuboi, Mark J. Kushner, Thorsten Lill, Pingshan Luan, Ali Mesbah, Eric Miller, Shoubhanik Nath, Yoshinobu Ohya, Mitsuhiro Omura, Chanhoon Park, John Poulose, Shahid Rauf, Makoto Sekine, Taylor G. Smith, Nathan Stafford, Theo Standaert, Peter L. G. Ventzek
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 041501 (2024)
https://doi.org/10.1116/6.0003579
Published: June 2024
View article titled, Future of plasma etching for microelectronics: Challenges and opportunities
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Journal Articles

Science challenges and research opportunities for plasma applications in microelectronics

FeaturedScilight
David B. Graves, Catherine B. Labelle, Mark J. Kushner, Eray S. Aydil, Vincent M. Donnelly, Jane P. Chang, Peter Mayer, Lawrence Overzet, Steven Shannon, Shahid Rauf, David N. Ruzic
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 042202 (2024)
https://doi.org/10.1116/6.0003531
Published: June 2024
View article titled, Science challenges and research opportunities for plasma applications in microelectronics
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Journal Articles

Temperature-induced degradation of GaN HEMT: An in situ heating study

Editor’s Pick
Md Abu Jafar Rasel, Di Zhang, Aiping Chen, Melonie Thomas, Stephen D. House, Winson Kuo, John Watt, Ahmad Islam, Nicholas Glavin, M. Smyth, Aman Haque, Douglas E. Wolfe, Stephen J. Pearton
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 032209 (2024)
https://doi.org/10.1116/6.0003490
Published: April 2024
View article titled, Temperature-induced degradation of GaN HEMT: An <em>in situ</em> heating study
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Includes: Supplementary data
Journal Articles

Fabrication of silicon sharp nanocones using dry etch with periodic oxygen plasma shrinking and wet etch

Renqiang Kang, Aixi Pan, Bo Cui
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 033002 (2024)
https://doi.org/10.1116/6.0003516
Published: April 2024
View article titled, Fabrication of silicon sharp nanocones using dry etch with periodic oxygen plasma shrinking and wet etch
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Journal Articles

Planar microcoil arrays for in vitro cellular-level micromagnetic activation of neurons

Featured
Renata Saha, Onri J. Benally, Sadegh Faramarzi, Robert Bloom, Kai Wu, Denis Tonini, Maple Shiao, Susan A. Keirstead, Walter C. Low, Theoden I. Netoff, Jian-Ping Wang
Journal: Journal of Vacuum Science & Technology B
J. Vac. Sci. Technol. B 42, 033001 (2024)
https://doi.org/10.1116/6.0003362
Published: April 2024
View article titled, Planar microcoil arrays for <em>in vitro</em> cellular-level micromagnetic activation of neurons
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Includes: Supplementary data
Journal Articles