This paper describes the design, fabrication, and characterization of a bulk-micromachined piezoelectric microphone for aeroacoustic applications. Microphone design was accomplished through a combination of piezoelectric composite plate theory and lumped element modeling. The device consists of a , -thick, silicon diaphragm with a -thick ring of piezoelectric material placed near the boundary of the diaphragm to maximize sensitivity. The microphone was fabricated by combining a sol-gel lead zirconate-titanate deposition process on a silicon-on-insulator wafer with deep-reactive ion etching for the diaphragm release. Experimental characterization indicates a sensitivity of , dynamic range greater than six orders of magnitude (, re ), a capacitance of , and a resonant frequency of .
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