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Journal Articles

Electrical transport characteristics of atomic contact and nanogap dynamically formed by electromigration

Tianran Zhao, Jieyi Zhang, Hefa Feng, Shoujun Peng, Dong Xiang
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 053505 (2024)
https://doi.org/10.1063/5.0225503
Published: July 2024
View article titled, Electrical transport characteristics of atomic contact and nanogap dynamically formed by electromigration
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Journal Articles

Twin deformation of Co nanorod filler during electromigration sliding inside multi-walled carbon nanotubes with the boundary fixed at the inner-diameter step

Shogo Matsuyama, Kanato Kumon, Hideo Kohno
Journal: Applied Physics Letters
Appl. Phys. Lett. 124, 243507 (2024)
https://doi.org/10.1063/5.0206008
Published: June 2024
View article titled, Twin deformation of Co nanorod filler during electromigration sliding inside multi-walled carbon nanotubes with the boundary fixed at the inner-diameter step
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Journal Articles

Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction

Yaqian Zhang, Leiming Du, Olof Bäcke, Sebastian Kalbfleisch, Guoqi Zhang, Sten Vollebregt, Magnus Hörnqvist Colliander
Journal: Applied Physics Letters
Appl. Phys. Lett. 124, 083501 (2024)
https://doi.org/10.1063/5.0192672
Published: February 2024
View article titled, Measuring residual stresses in individual on-chip interconnects using synchrotron nanodiffraction
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Includes: Supplementary data
Journal Articles

Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation

H. Y. Yuan, C. Li, H. Z. Zhang, M. Z. Fan, Z. L. Ma, X. W. Cheng
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 231904 (2023)
https://doi.org/10.1063/5.0176416
Published: December 2023
View article titled, Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-<em>in situ</em> study combining 3D microstructural characterization and numerical simulation
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Includes: Supplementary data
Journal Articles

High temperature electromigration behavior of cobalt lines observed by in situ transmission electron microscopy

Brent Engler, Robert Hull
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 083502 (2023)
https://doi.org/10.1063/5.0160825
Published: August 2023
View article titled, High temperature electromigration behavior of cobalt lines observed by <em>in situ</em> transmission electron microscopy
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Journal Articles

Anisotropic strain variations during the confined growth of Au nanowires

Giuseppe Abbondanza, Andrea Grespi, Alfred Larsson, Lorena Glatthaar, Tim Weber, Malte Blankenburg, Zoltan Hegedüs, Ulrich Lienert, Herbert Over, Edvin Lundgren
Journal: Applied Physics Letters
Appl. Phys. Lett. 122, 123101 (2023)
https://doi.org/10.1063/5.0138891
Published: March 2023
View article titled, Anisotropic strain variations during the confined growth of Au nanowires
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Includes: Supplementary data
Journal Articles

Electromigration reliability and activation energy of Bi2Te3 thermoelectric film

Chaojie Ren, Wei Zhu, Jie Zhou, Xue Wu, Yuan Deng
Journal: Applied Physics Letters
Appl. Phys. Lett. 120, 062105 (2022)
https://doi.org/10.1063/5.0081265
Published: February 2022
View article titled, Electromigration reliability and activation energy of Bi<sub>2</sub>Te<sub>3</sub> thermoelectric film
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Journal Articles

Memory properties of electromigrated Au nanogaps to realize reservoir computing

Keita Sakai, Mamiko Yagi, Mitsuki Ito, Jun-ichi Shirakashi
Journal: Applied Physics Letters
Appl. Phys. Lett. 119, 084101 (2021)
https://doi.org/10.1063/5.0055352
Published: August 2021
View article titled, Memory properties of electromigrated Au nanogaps to realize reservoir computing
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Journal Articles

Voltage controlled awakening of memristor-like dynamic current–voltage loops of ferroelectric triglycine sulfate

Nicholas V. Morozovsky
Journal: Applied Physics Letters
Appl. Phys. Lett. 118, 192902 (2021)
https://doi.org/10.1063/5.0048356
Published: May 2021
View article titled, Voltage controlled awakening of memristor-like dynamic current–voltage loops of ferroelectric triglycine sulfate
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Journal Articles

Suppressive effect of Ni–Sn internal electrode at the anode on the leakage current degradation of BaTiO3-based multilayer ceramic capacitors

Shoichiro Suzuki, Shinichi Yamaguchi, Akitaka Doi, Akihiro Shiota, Naoki Iwaji, Shunsuke Abe, Makoto Matsuda, Tomoyuki Nakamura, Harunobu Sano
Journal: Applied Physics Letters
Appl. Phys. Lett. 118, 112904 (2021)
https://doi.org/10.1063/5.0044408
Published: March 2021
View article titled, Suppressive effect of Ni–Sn internal electrode at the anode on the leakage current degradation of BaTiO<sub>3</sub>-based multilayer ceramic capacitors
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Journal Articles

Low-frequency noise and thermal equilibrium properties of vacancies

Sofie Beyne, Ingrid De Wolf, Zsolt Tőkei, Kristof Croes
Journal: Applied Physics Letters
Appl. Phys. Lett. 116, 193501 (2020)
https://doi.org/10.1063/1.5140453
Published: May 2020
View article titled, Low-frequency noise and thermal equilibrium properties of vacancies
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Journal Articles

Residual stress effect governing electromigration-based free-standing metallic micro/nanowire growth behavior

Yasuhiro Kimura, Yang Ju
Journal: Applied Physics Letters
Appl. Phys. Lett. 116, 024102 (2020)
https://doi.org/10.1063/1.5131710
Published: January 2020
View article titled, Residual stress effect governing electromigration-based free-standing metallic micro/nanowire growth behavior
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Journal Articles

In-situ control of electrical properties of nanoelectromechanical resonators by electromigration for self-sustained oscillations

F. Sun, J. Zou, H. B. Chan
Journal: Applied Physics Letters
Appl. Phys. Lett. 115, 203101 (2019)
https://doi.org/10.1063/1.5127237
Published: November 2019
View article titled, <em>In-situ</em> control of electrical properties of nanoelectromechanical resonators by electromigration for self-sustained oscillations
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Includes: Supplementary data
Journal Articles

Efficient heating of single-molecule junctions for thermoelectric studies at cryogenic temperatures

Pascal Gehring, Martijn van der Star, Charalambos Evangeli, Jennifer J. Le Roy, Lapo Bogani, Oleg V. Kolosov, Herre S. J. van der Zant
Journal: Applied Physics Letters
Appl. Phys. Lett. 115, 073103 (2019)
https://doi.org/10.1063/1.5118861
Published: August 2019
View article titled, Efficient heating of single-molecule junctions for thermoelectric studies at cryogenic temperatures
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Includes: Supplementary data
Journal Articles

Electrolyte gate controlled metal-insulator transitions of the CaZrO3/SrTiO3 heterointerface

Wei Niu, Yongda Chen, Yulin Gan, Yu Zhang, Xiaoqian Zhang, Xiao Yuan, Zhi Cao, Wenqing Liu, Yongbing Xu, Rong Zhang, Nini Pryds, Yunzhong Chen, Yong Pu, Xuefeng Wang
Journal: Applied Physics Letters
Appl. Phys. Lett. 115, 061601 (2019)
https://doi.org/10.1063/1.5108813
Published: August 2019
View article titled, Electrolyte gate controlled metal-insulator transitions of the CaZrO<sub>3</sub>/SrTiO<sub>3</sub> heterointerface
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Includes: Supplementary data
Journal Articles

Low-frequency noise and defects in copper and ruthenium resistors

D. M. Fleetwood, S. Beyne, R. Jiang, S. E. Zhao, P. Wang, S. Bonaldo, M. W. McCurdy, Zs. Tőkei, I. DeWolf, Kristof Croes, E. X. Zhang, M. L. Alles, R. D. Schrimpf, R. A. Reed, D. Linten
Journal: Applied Physics Letters
Appl. Phys. Lett. 114, 203501 (2019)
https://doi.org/10.1063/1.5093549
Published: May 2019
View article titled, Low-frequency noise and defects in copper and ruthenium resistors
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Journal Articles

Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain

Wenhui Zhu, Hanjie Yang, Zhuo Chen
Journal: Applied Physics Letters
Appl. Phys. Lett. 113, 103502 (2018)
https://doi.org/10.1063/1.5044554
Published: September 2018
View article titled, Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain
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Journal Articles

Remote access to electrical conductivity by charge attachment from an ambient pressure plasma

Jan L. Wiemer, Karl-Michael Weitzel
Journal: Applied Physics Letters
Appl. Phys. Lett. 113, 052902 (2018)
https://doi.org/10.1063/1.5045530
Published: July 2018
View article titled, Remote access to electrical conductivity by charge attachment from an ambient pressure plasma
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Journal Articles

Study of the enhanced electromigration performance of Cu(Mn) by low-frequency noise measurements and atom probe tomography

Sofie Beyne, Laurent Arnoldi, Ingrid De Wolf, Zsolt Tőkei, Kristof Croes
Journal: Applied Physics Letters
Appl. Phys. Lett. 111, 083105 (2017)
https://doi.org/10.1063/1.4989898
Published: August 2017
View article titled, Study of the enhanced electromigration performance of Cu(Mn) by low-frequency noise measurements and atom probe tomography
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Journal Articles

Through-membrane electron-beam lithography for ultrathin membrane applications

M. Neklyudova, A. K. Erdamar, L. Vicarelli, S. J. Heerema, T. Rehfeldt, G. Pandraud, Z. Kolahdouz, C. Dekker, H. W. Zandbergen
Journal: Applied Physics Letters
Appl. Phys. Lett. 111, 063105 (2017)
https://doi.org/10.1063/1.4986991
Published: August 2017
View article titled, Through-membrane electron-beam lithography for ultrathin membrane applications
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Includes: Supplementary data