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Journal Articles

Role of copper in time dependent dielectric breakdown of porous organo-silicate glass low-k materials

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Larry Zhao, Marianna Pantouvaki, Kristof Croes, Zsolt Tőkei, Yohan Barbarin, Christopher J. Wilson, Mikhail R. Baklanov, Gerald P. Beyer, Cor Claeys
Journal: Applied Physics Letters
Appl. Phys. Lett. 99, 222110 (2011)
https://doi.org/10.1063/1.3664405
Published: December 2011
View articletitled, Role of copper in time dependent dielectric breakdown of porous organo-silicate glass low-k materials
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Journal Articles

Cu penetration into low- k dielectric during deposition and bias-temperature stress

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Ming He, Steven Novak, Lakshmanan Vanamurthy, Hassaram Bakhru, Joel Plawsky, Toh-Ming Lu
Journal: Applied Physics Letters
Appl. Phys. Lett. 97, 252901 (2010)
https://doi.org/10.1063/1.3529492
Published: December 2010
View articletitled, Cu penetration into low- k dielectric during deposition and bias-temperature stress
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Journal Articles

Real time estimation of equivalent cantilever parameters in tapping mode atomic force microscopy

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Pranav Agarwal, Murti V. Salapaka
Journal: Applied Physics Letters
Appl. Phys. Lett. 95, 083113 (2009)
https://doi.org/10.1063/1.3206740
Published: August 2009
View articletitled, Real time estimation of equivalent cantilever parameters in tapping mode atomic force microscopy
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Journal Articles

Correlation between a threshold failure time and void nucleation for describing the bimodal electromigration behavior of copper interconnects

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R. G. Filippi, P.-C. Wang, A. Brendler, J. R. Lloyd
Journal: Applied Physics Letters
Appl. Phys. Lett. 95, 072111 (2009)
https://doi.org/10.1063/1.3200233
Published: August 2009
View articletitled, Correlation between a threshold failure time and void nucleation for describing the bimodal electromigration behavior of copper interconnects
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Journal Articles

Highly efficient organic tandem solar cells using an improved connecting architecture

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A. G. F. Janssen, T. Riedl, S. Hamwi, H.-H. Johannes, W. Kowalsky
Journal: Applied Physics Letters
Appl. Phys. Lett. 91, 073519 (2007)
https://doi.org/10.1063/1.2772208
Published: August 2007
View articletitled, Highly efficient organic tandem solar cells using an improved connecting architecture
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Journal Articles

Lifetime modeling for stress-induced voiding in integrated circuit interconnections

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Cher Ming Tan, Yuejin Hou
Journal: Applied Physics Letters
Appl. Phys. Lett. 91, 061904 (2007)
https://doi.org/10.1063/1.2766695
Published: August 2007
View articletitled, Lifetime modeling for stress-induced voiding in integrated circuit interconnections
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Journal Articles

Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

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A. V. Vairagar, S. G. Mhaisalkar, M. A. Meyer, E. Zschech, Ahila Krishnamoorthy, K. N. Tu, A. M. Gusak
Journal: Applied Physics Letters
Appl. Phys. Lett. 87, 081909 (2005)
https://doi.org/10.1063/1.2033136
Published: August 2005
View articletitled, Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures
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Journal Articles

The effect of scaling microlasers on modal noise

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S. M. K. Thiyagarajan, A. F. J. Levi
Journal: Applied Physics Letters
Appl. Phys. Lett. 69, 3459–3461 (1996)
https://doi.org/10.1063/1.117251
Published: December 1996
View articletitled, The effect of scaling microlasers on modal noise
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