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Journal Articles

Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer

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Achintya Paradkar, Paul Nicaise, Karim Dakroury, Fabian Resare, Witlef Wieczorek
Journal: Applied Physics Letters
Appl. Phys. Lett. 126, 022601 (2025)
https://doi.org/10.1063/5.0235266
Published: January 2025
View article titled, Superconducting flip-chip devices using indium microspheres on Au-passivated Nb or NbN as under-bump metallization layer
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Journal Articles

High-quality temperature-complementary bulk acoustic wave resonators fabricated with strippable single-crystalline AlN films grown on sapphire

Tianyou Luo, Yinuo Zhang, Zhipeng Chen, Kaibin Xu, Peidong Ouyang, Han Hu, Chenyang Li, Yuhan Zhu, Xinyan Yi, Guoqiang Li
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 212101 (2024)
https://doi.org/10.1063/5.0231483
Published: November 2024
View article titled, High-quality temperature-complementary bulk acoustic wave resonators fabricated with strippable single-crystalline AlN films grown on sapphire
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Journal Articles

Coupled terahertz quantum cascade wire lasers

Marie C. Ertl, Michael Jaidl, Benedikt Limbacher, Dominik Theiner, Miriam Giparakis, Stefania Isceri, Maximilian Beiser, Aaron Maxwell Andrews, Gottfried Strasser, Juraj Darmo, Karl Unterrainer
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 121115 (2024)
https://doi.org/10.1063/5.0230401
Published: September 2024
View article titled, Coupled terahertz quantum cascade wire lasers
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Journal Articles

Tunable coupling of a quantum phononic resonator to a transmon qubit via galvanic-contact flip-chip architecture

Xinhui Ruan, Li Li, Guihan Liang, Silu Zhao, Jia-heng Wang, Yizhou Bu, Bingjie Chen, Xiaohui Song, Xiang Li, He Zhang, Jinzhe Wang, Qianchuan Zhao, Kai Xu, Heng Fan, Yu-xi Liu, Jing Zhang, Zhihui Peng, Zhongcheng Xiang, Dongning Zheng
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 052603 (2024)
https://doi.org/10.1063/5.0216607
Published: July 2024
View article titled, Tunable coupling of a quantum phononic resonator to a transmon qubit via galvanic-contact flip-chip architecture
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Journal Articles

Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits

Jean-Marc Boucaud, Cédric Durand, Frédéric Gianesello, Davide Bucci, Jean-Emmanuel Broquin, Emmanuel Dubois
Journal: Applied Physics Letters
Appl. Phys. Lett. 125, 054101 (2024)
https://doi.org/10.1063/5.0221309
Published: July 2024
View article titled, Glass interposer for heterogeneous integration of flip-chipped photonic and electronic integrated circuits
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Journal Articles

Significant conductivity enhancement in Al-rich n-AlGaN by modulation doping

Xuzhou Fang, Jiaming Wang, Fujun Xu, Lisheng Zhang, Jing Lang, Xueqi Guo, Chen Ji, Chengzhi Ji, Yong Wu, Xuelin Yang, Xiangning Kang, Zhixin Qin, Ning Tang, Xinqiang Wang, Weikun Ge, Bo Shen
Journal: Applied Physics Letters
Appl. Phys. Lett. 124, 152106 (2024)
https://doi.org/10.1063/5.0197761
Published: April 2024
View article titled, Significant conductivity enhancement in Al-rich n-AlGaN by modulation doping
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Includes: Supplementary data
Journal Articles

The improvement of bonding metal layers for high resolution micro-LED display application

Xiaoxiao Ji, Kefeng Wang, Haojie Zhou, Fei Wang, Luqiao Yin, Jianhua Zhang
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 241102 (2023)
https://doi.org/10.1063/5.0177351
Published: December 2023
View article titled, The improvement of bonding metal layers for high resolution micro-LED display application
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Journal Articles

Deep-ultraviolet light communication in sunlight using 275-nm LEDs

Ziqian Qi, Linning Wang, Yingze Liang, Pengzhan Liu, Hongbo Zhu, Yongjin Wang
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 161109 (2023)
https://doi.org/10.1063/5.0169319
Published: October 2023
View article titled, Deep-ultraviolet light communication in sunlight using 275-nm LEDs
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Includes: Supplementary data
Journal Articles

Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits

T. M. Hazard, W. Woods, D. Rosenberg, R. Das, C. F. Hirjibehedin, D. K. Kim, J. M. Knecht, J. Mallek, A. Melville, B. M. Niedzielski, K. Serniak, K. M. Sliwa, D. R. W. Yost, J. L. Yoder, W. D. Oliver, M. E. Schwartz
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 154004 (2023)
https://doi.org/10.1063/5.0170055
Published: October 2023
View article titled, Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits
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Journal Articles

Thermal resistance in superconducting flip-chip assemblies

J. Hätinen, E. Mykkänen, K. Viisanen, A. Ronzani, A. Kemppinen, L. Lehtisyrjä, J. S. Lehtinen, M. Prunnila
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 152202 (2023)
https://doi.org/10.1063/5.0162409
Published: October 2023
View article titled, Thermal resistance in superconducting flip-chip assemblies
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Includes: Supplementary data
Journal Articles

Flexible integration of gigahertz nanomechanical resonators with a superconducting microwave resonator using a bonded flip-chip method

Sultan Malik, Wentao Jiang, Felix M. Mayor, Takuma Makihara, Amir H. Safavi-Naeini
Journal: Applied Physics Letters
Appl. Phys. Lett. 123, 104001 (2023)
https://doi.org/10.1063/5.0157516
Published: September 2023
View article titled, Flexible integration of gigahertz nanomechanical resonators with a superconducting microwave resonator using a bonded flip-chip method
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Includes: Supplementary data
Journal Articles

Indium-bond-and-stop-etch (IBASE) technique for dual-side processing of thin high-mobility GaAs/AlGaAs epitaxial layers

C. Yoo, K. W. West, L. N. Pfeiffer, C. A. Curwen, J. H. Kawamura, B. S. Karasik, M. S. Sherwin
Journal: Applied Physics Letters
Appl. Phys. Lett. 122, 233502 (2023)
https://doi.org/10.1063/5.0147343
Published: June 2023
View article titled, Indium-bond-and-stop-etch (IBASE) technique for dual-side processing of thin high-mobility GaAs/AlGaAs epitaxial layers
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Includes: Supplementary data
Journal Articles

Enhanced p-type Ohmic contact performance in FCLEDs by manipulating thermal stress distribution to suppress Ag agglomeration

Ke Sun, Yinzuo Qian, Zhenxing Lv, Shengli Qi, Shengjun Zhou
Journal: Applied Physics Letters
Appl. Phys. Lett. 122, 202104 (2023)
https://doi.org/10.1063/5.0148796
Published: May 2023
View article titled, Enhanced p-type Ohmic contact performance in FCLEDs by manipulating thermal stress distribution to suppress Ag agglomeration
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Journal Articles

Strain induced power enhancement of far-UVC LEDs on high temperature annealed AlN templates

Editor’s Pick
A. Knauer, T. Kolbe, S. Hagedorn, J. Hoepfner, M. Guttmann, H. K. Cho, J. Rass, J. Ruschel, S. Einfeldt, M. Kneissl, M. Weyers
Journal: Applied Physics Letters
Appl. Phys. Lett. 122, 011102 (2023)
https://doi.org/10.1063/5.0134253
Published: January 2023
View article titled, Strain induced power enhancement of far-UVC LEDs on high temperature annealed AlN templates
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Journal Articles

High-performance direct terahertz modulator based on resonance mode transformation for high-speed wireless communication

Editor’s Pick
Sen Gong, Dianyuan Ping, Chunyang Bi, Zhenpeng Zhang, Shixiong Liang, Lan Wang, Hongxin Zeng, Kesen Ding, Yazhou Dong, Hongji Zhou, Ziqiang Yang, Jian Wu, Yaxin Zhang
Journal: Applied Physics Letters
Appl. Phys. Lett. 121, 231104 (2022)
https://doi.org/10.1063/5.0121712
Published: December 2022
View article titled, High-performance direct terahertz modulator based on resonance mode transformation for high-speed wireless communication
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Journal Articles

Generation of sidewall defects in InGaN/GaN blue micro-LEDs under forward-current stress

Abu Bashar Mohammad Hamidul Islam, Tae Kyoung Kim, Dong-Soo Shin, Jong-In Shim, Joon Seop Kwak
Journal: Applied Physics Letters
Appl. Phys. Lett. 121, 013501 (2022)
https://doi.org/10.1063/5.0089650
Published: July 2022
View article titled, Generation of sidewall defects in InGaN/GaN blue micro-LEDs under forward-current stress
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Journal Articles

Silicon integrated terahertz quantum cascade ring laser frequency comb

M. Jaidl, N. Opačak, M. A. Kainz, D. Theiner, B. Limbacher, M. Beiser, M. Giparakis, A. M. Andrews, G. Strasser, B. Schwarz, J. Darmo, K. Unterrainer
Journal: Applied Physics Letters
Appl. Phys. Lett. 120, 091106 (2022)
https://doi.org/10.1063/5.0078749
Published: March 2022
View article titled, Silicon integrated terahertz quantum cascade ring laser frequency comb
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Journal Articles

Vacuum-gap transmon qubits realized using flip-chip technology

Editor’s Pick
Xuegang Li, Yingshan Zhang, Chuhong Yang, Zhiyuan Li, Junhua Wang, Tang Su, Mo Chen, Yongchao Li, Chengyao Li, Zhenyu Mi, Xuehui Liang, Chenlu Wang, Zhen Yang, Yulong Feng, Kehuan Linghu, Huikai Xu, Jiaxiu Han, Weiyang Liu, Peng Zhao, Teng Ma, Ruixia Wang, Jingning Zhang, Yu Song, Pei Liu, Ziting Wang, Zhaohua Yang, Guangming Xue, Yirong Jin, Haifeng Yu
Journal: Applied Physics Letters
Appl. Phys. Lett. 119, 184003 (2021)
https://doi.org/10.1063/5.0068255
Published: November 2021
View article titled, Vacuum-gap transmon qubits realized using flip-chip technology
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Includes: Supplementary data
Journal Articles

Superconducting qubits in a flip-chip architecture

Editor’s Pick
C. R. Conner, A. Bienfait, H.-S. Chang, M.-H. Chou, É. Dumur, J. Grebel, G. A. Peairs, R. G. Povey, H. Yan, Y. P. Zhong, A. N. Cleland
Journal: Applied Physics Letters
Appl. Phys. Lett. 118, 232602 (2021)
https://doi.org/10.1063/5.0050173
Published: June 2021
View article titled, Superconducting qubits in a flip-chip architecture
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Journal Articles

Measurements of a quantum bulk acoustic resonator using a superconducting qubit

M.-H. Chou, É. Dumur, Y. P. Zhong, G. A. Peairs, A. Bienfait, H.-S. Chang, C. R. Conner, J. Grebel, R. G. Povey, K. J. Satzinger, A. N. Cleland
Journal: Applied Physics Letters
Appl. Phys. Lett. 117, 254001 (2020)
https://doi.org/10.1063/5.0023827
Published: December 2020
View article titled, Measurements of a quantum bulk acoustic resonator using a superconducting qubit
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