In recent years, lifetime measurements by means of the Time Correlated Single Photon Counting (TCSPC) technique have led to a significant breakthrough in medical and biological fields. Unfortunately, the many advantages of TCSPC-based approaches come along with the major drawback of a relatively long acquisition time. The exploitation of multiple channels in parallel could in principle mitigate this issue, and at the same time it opens the way to a multi-parameter analysis of the optical signals, e.g., as a function of wavelength or spatial coordinates. The TCSPC multichannel solutions proposed so far, though, suffer from a tradeoff between number of channels and performance, and the overall measurement speed has not been increased according to the number of channels, thus reducing the advantages of having a multichannel system. In this paper, we present a novel readout architecture for bi-dimensional, high-density Single Photon Avalanche Diode (SPAD) arrays, specifically designed to maximize the throughput of the whole system and able to guarantee an efficient use of resources. The core of the system is a routing logic that can provide a dynamic connection between a large number of SPAD detectors and a much lower number of high-performance acquisition channels. A key feature of our smart router is its ability to guarantee high efficiency under any operating condition.

1.
H.
Wallrabe
and
A.
Periasamy
,
Curr. Opin. Biotechnol.
16
,
1
(
2005
).
2.
K.
Suhling
,
P. M. W.
French
, and
D.
Phillips
,
Photochem. Photobiol. Sci.
4
,
1
(
2005
).
3.
W.
Becker
,
Advanced Time-Correlated Single Photon Counting Techniques
(
Springer
,
Berlin
,
2005
).
6.
See http://www.becker-hickl.de/products.htm for Becker & Hickl GmbH, “TCSPC-Modules.”
7.
C.
Veerappan
,
J.
Richardson
,
R.
Walker
,
D. U.
Li
,
M. W.
Fishburn
,
Y.
Maruyama
,
D.
Stoppa
,
F.
Borghetti
,
M.
Gersbach
,
R. K.
Henderson
, and
E.
Charbon
, in
Proceedings of IEEE International Solid-State Circuits Conference
(
IEEE
,
2011
), pp.
312
313
.
8.
D.
Bronzi
,
F.
Villa
,
S.
Tisa
,
A.
Tosi
,
F.
Zappa
,
D.
Durini
,
S.
Weyers
, and
W.
Brockherde
,
IEEE J. Sel. Top. Quantum Electron.
20
,
6
(
2014
).
9.
R. M.
Field
,
S.
Realov
, and
K. L.
Shepard
,
IEEE J. Solid-State Circuits
49
,
4
(
2014
).
10.
L.
Parmesan
,
N. A.
Dutton
,
N. J.
Calder
,
N.
Krstajic
,
A. J.
Holmes
,
L. A.
Grant
, and
R. K.
Henderson
, “
A 256 x 256 SPAD array with in-pixel Time to Amplitude Conversion for Fluorescence Lifetime Imaging Microscopy
,”
paper presented at International Image Sensor Workshop
,
Vaals, Netherlands,
Memory, 900(M4), M5 (2015).
11.
C.
Niclass
,
C.
Favi
,
T.
Kluter
,
M.
Gersbach
, and
E.
Charbon
,
IEEE J. Solid-State Circuits
43
,
12
(
2008
).
12.
M.
Ghioni
,
A.
Gulinatti
,
I.
Rech
,
F.
Zappa
, and
S.
Cova
,
IEEE J. Sel. Top. Quantum Electron.
13
,
4
(
2007
).
13.
D.
Bronzi
,
F.
Villa
,
S.
Tisa
,
A.
Tosi
, and
F.
Zappa
,
IEEE Sens. J.
16
,
1
(
2016
).
14.
D.
Stoppa
,
F.
Borghetti
,
J.
Richardson
,
R.
Walker
,
L.
Grant
,
R. K.
Henderson
,
M.
Gersbach
, and
E.
Charbon
, in
Proceedings of IEEE European Solid-State Device Conference
(
IEEE
,
2009
), pp.
204
207
.
15.
C.
Niclass
,
M.
Sergio
, and
E.
Charbon
,
Proc. SPIE
6372
,
63720S
(
2006
).
16.
J.
Frechette
,
P. J.
Grossmann
,
D. E.
Busacker
,
G. J.
Jordy
,
E. K.
Duerr
,
K. A.
McIntosh
,
D. C.
Oakley
,
R. J.
Bailey
,
A. C.
Ruff
, and
M. A.
Brattain
,
Proc. SPIE
8375
,
63720S
(
2012
).
17.
D.
Tyndall
,
B.
Rae
,
D.
Li
,
J.
Richardson
,
J.
Arlt
, and
R.
Henderson
, in
Proceedings of IEEE International Solid-State Circuits Conference
(
IEEE
,
2012
), pp.
122
123
.
18.
M.
Crotti
,
I.
Rech
, and
M.
Ghioni
,
IEEE J. Solid-State Circuits
47
,
3
(
2012
).
19.
B.
Markovic
,
S.
Tisa
,
F. A.
Villa
, and
F.
Zappa
,
IEEE Trans. Circuits Syst.
60
,
3
(
2013
).
20.
P.
Peronio
,
G.
Acconcia
,
I.
Rech
, and
M.
Ghioni
,
Rev. Sci. Instrum.
86
,
11
(
2015
).
21.
T. C.
Weigandt
,
B. K. B.
Kim
, and
P. R.
Gray
, in
Proceedings of IEEE International Symposium on Circuits and Systems
(
IEEE
,
1994
), pp.
27
30
.
22.
See http://www.ti.com/product/LMH7324/description Texas Instrument, “LMH7324 datasheet.”
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