We have developed a modular interconnect platform for the control and readout of multiple solid-state qubits at cryogenic temperatures. The setup provides 74 filtered dc-bias connections, 32 control and readout connections with −3 dB frequency above 5 GHz, and 4 microwave feed lines that allow low loss (less than 3 dB) transmission 10 GHz. The incorporation of a radio-frequency interposer enables the platform to be separated into two printed circuit boards, decoupling the simple board that is bonded to the qubit chip from the multilayer board that incorporates expensive connectors and components. This modular approach lifts the burden of duplicating complex interconnect circuits for every prototype device. We report the performance of this platform at milli-Kelvin temperatures, including signal transmission and crosstalk measurements.
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November 2014
Research Article|
November 17 2014
Modular cryogenic interconnects for multi-qubit devices Available to Purchase
J. I. Colless;
J. I. Colless
ARC Centre of Excellence for Engineered Quantum Systems, School of Physics,
The University of Sydney
, Sydney, NSW 2006, Australia
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D. J. Reilly
D. J. Reilly
a)
ARC Centre of Excellence for Engineered Quantum Systems, School of Physics,
The University of Sydney
, Sydney, NSW 2006, Australia
Search for other works by this author on:
J. I. Colless
ARC Centre of Excellence for Engineered Quantum Systems, School of Physics,
The University of Sydney
, Sydney, NSW 2006, Australia
D. J. Reilly
a)
ARC Centre of Excellence for Engineered Quantum Systems, School of Physics,
The University of Sydney
, Sydney, NSW 2006, Australia
a)
Email: [email protected]
Rev. Sci. Instrum. 85, 114706 (2014)
Article history
Received:
May 21 2014
Accepted:
October 21 2014
Citation
J. I. Colless, D. J. Reilly; Modular cryogenic interconnects for multi-qubit devices. Rev. Sci. Instrum. 1 November 2014; 85 (11): 114706. https://doi.org/10.1063/1.4900948
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