A procedure is described for making a solder connection to Al at large area interfaces. By avoiding the use of flux, defect‐free joints may be achieved.

1.
I. A.
Campbell
,
A. D.
Caplin
, and
C.
Rizzuto
,
Phys. Rev. Lett.
26
,
239
(
1971
).
2.
J. W.
Ekin
and
B. W.
Maxfield
,
Phys. Rev. B
2
,
4805
(
1970
).
3.
J. C.
Garland
and
R.
Bowers
,
Phys. Rev. Lett.
21
,
1007
(
1968
).
4.
J. M.
Diamond
and
B. S.
Jensen
,
Rev. Sci. Instrum.
43
,
702
(
1972
).
5.
The source for Castolin 157 is S. A. Castolin, Lausanne St. Sulpice, Switzerland.
This content is only available via PDF.
You do not currently have access to this content.