An apparatus suitable for the measurement, in vacuum, of the residual stress in evaporated metal or dielectric films has been built and tested. The substrate on which the film is deposited is clamped at one end to form a cantilevered beam. When the substrate is bent as a result of the film stress, the force required to restore the beam to its initial position is measured. The stress is then calculated from a knowledge of the restoring force, the beam dimensions, and the film thickness. A stress of 5×107 d/cm2 can be easily detected and measured with this apparatus.
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© 1962 The American Institute of Physics.
1962
The American Institute of Physics
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