We investigate the potential uses for random heteropolymers (RHPs) as adhesion promoters between a homopolymer melt and a solid surface. We consider homopolymers of monomer (segment) type A which are naturally repelled from a solid surface. To this system we add RHPs with both A and B (attractive to the surface) type monomers to promote adhesion between the two incompatible substrates. We employ Monte Carlo simulations to investigate the effects of variations in the sequence statistics of the RHPs, amount of promoter added, and strength of the segment–segment and segment–surface interaction parameters. Clearly, the parameter space in such a system is quite large, but we are able to describe, in a qualitative manner, the optimal parameters for adhesion promotion. The optimal set of parameters yield interfacial conformational statistics for the RHPs which have a relatively high adsorbed fraction and also long loops extending away from the surface that promote entanglements with the bulk homopolymer melt. In addition, we present qualitative evidence that the concentration of RHP segments per surface site plays an important role in determining the mechanism of failure (cohesive versus adhesive) at such an interface. Our results also provide the necessary input for future simulations in which the system may be strained to the limit of fracture.
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15 November 1998
Research Article|
November 15 1998
Adhesion promotion at a homopolymer–solid interface using random heteropolymers
Edward Read Simmons;
Edward Read Simmons
Department of Chemical Engineering, University of California, Berkeley, California 94720
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Arup K. Chakraborty
Arup K. Chakraborty
Department of Chemical Engineering and Department of Chemistry, University of California, Berkeley, California 94720
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J. Chem. Phys. 109, 8667–8676 (1998)
Article history
Received:
June 08 1998
Accepted:
August 11 1998
Citation
Edward Read Simmons, Arup K. Chakraborty; Adhesion promotion at a homopolymer–solid interface using random heteropolymers. J. Chem. Phys. 15 November 1998; 109 (19): 8667–8676. https://doi.org/10.1063/1.477534
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