Key aspects of the growth process of epitaxial with crystalline interface on silicon are outlined. An important step in this process is the solid phase epitaxy in ultrahigh vacuum of amorphous on top of a few monolayer thick, low-temperature grown, epitaxial template. Insufficient oxygen supply during the deposition step causes the formation of amorphous alkaline-earth silicates and at the Si∕epitaxial oxide interface during ultrahigh vacuum annealing. Performing deposition in excess , this interfacial reaction is suppressed, and a metal-insulator-semiconductor capacitance equivalent to of is obtained for a cell cell stack.
REFERENCES
1.
D.
Lammers
, EE Times, 2 July 2001
(http://www.eetimes.com/news/latest/technology/showArticle.jhtml?articleID=10808904);P.
Clarke
, EE Times, 14 April 2005
(http://www.eetimes.com/news/latest/technology/showArticle.jhtml?articleID=160900376).2.
3.
C. R.
Ashman
, C. J.
Foerst
, K.
Schwarz
, and P. E.
Bloechl
, Phys. Rev. B
69
, 075309
(2004
).4.
S. A.
Chambers
, Y.
Liang
, Z.
Yu
, R.
Droopad
, and J.
Ramdani
, J. Vac. Sci. Technol. A
19
, 934
(2001
).5.
C. J.
Foerst
, C. R.
Ashman
, K.
Schwarz
, and P. E.
Bloechl
, Nature (London)
427
, 53
(2004
).6.
R. A.
McKee
, F. J.
Walker
, and M. F.
Chisholm
, Phys. Rev. Lett.
81
, 3014
(1998
).7.
R.
Droopad
et al, J. Cryst. Growth
227–228
, 936
(2001
).8.
K.
Eisenbeiser
et al, Appl. Phys. Lett.
76
, 1324
(2000
).9.
S.
Jeon
, F. J.
Walker
, C. A.
Billman
, R. A.
McKee
, and H.
Hwang
, IEEE Electron Device Lett.
24
, 218
(2003
).10.
G. J.
Norga
et al, Mater. Res. Soc. Symp. Proc.
786
, 219
(2004
).11.
J. Q.
He
, C. L.
Jia
, V.
Vaithyanathan
, D. G.
Schlom
, J.
Schubert
, A.
Gerber
, H. H.
Kohlstedt
, and R. H.
Wang
, J. Appl. Phys.
97
, 104921
(2005
).12.
J. H.
Hao
, J.
Gao
, Z.
Wang
, and D. P.
Yu
, Appl. Phys. Lett.
87
, 131908
(2005
).13.
G. J.
Norga
et al, Appl. Phys. Lett.
87
, 262905
(2005
).14.
15.
Ch.
Marchiori
, Ph.D. thesis, Department of Materials Science, Università degli Studi di Milano—Bicocca
, 2005
.16.
Y.
Liang
, S.
Gan
, and M.
Engelhard
, Appl. Phys. Lett.
79
, 3591
(2001
).17.
R.
Larciprete
, M.
Danailov
, A.
Barinov
, L.
Gregoratti
, and M.
Kiskinova
, J. Appl. Phys.
90
, 4361
(2001
).18.
K.
Holloway
and R.
Sinclair
, J. Appl. Phys.
61
, 1359
(1987
).19.
S.
Stemmer
, J. Vac. Sci. Technol. B B
, 22
–791
(2004
).20.
C. M.
Perkins
, B. B.
Triplett
, P. C.
McIntyre
, K. C.
Saraswat
, and E.
Shero
, Appl. Phys. Lett.
81
, 1417
(2002
).21.
22.
M. A.
Gribelyuk
, A.
Callegari
, E. P.
Gusev
, M.
Copel
, and D. A.
Buchanan
, J. Appl. Phys.
92
, 1232
(2002
).23.
24.
J. R.
Hauser
and K.
Ahmed
, AIP Conf. Proc.
449
, 235
(1998
).25.
T. R.
Taylor
, P. J.
Hansen
, N.
Pervez
, B.
Acikel
, R. A.
York
, and J. S.
Speck
, J. Appl. Phys.
94
, 3390
(2003
).© 2006 American Institute of Physics.
2006
American Institute of Physics
You do not currently have access to this content.