An extended Mie-Grüneisen molecular model is presented, which describes a bond-breakage process for OSiO3 tetragonal molecules in silica and the trap-generation process that occurs during time dependent dielectric breakdown (TDDB) testing. This quantitative molecular model correctly describes important physics routinely reported for silica TDDB testing: the generation of E centers, a breakdown strength of Ebd15MVcm, an effective dipole-moment range of peff=713eÅ, and a zero-field activation energy range for bond breakage of ΔHo*=12eV. The bond-breakage/trap-generation mechanism is shown to occur when the Si ion transitions from its primary energy minimum (with fourfold coordination) to a secondary saddle point (with threefold coordination). The molecular model also shows clearly that current induced hole capture and hydrogen release can play critically important roles in the TDDB process.

1.
B.
Schlund
 et al.,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
1996
), p.
84
.
2.
J.
McPherson
and
H.
Mogul
,
J. Appl. Phys.
84
,
1513
(
1998
).
3.
M.
Kimura
and
H.
Koyama
,
J. Appl. Phys.
85
,
7671
(
1999
).
4.
K. P.
Cheung
,
Tech. Dig. - Int. Electron Devices Meet.
1999
,
719
.
5.
C.
Hu
and
Q.
Lu
,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
1999
), p.
47
.
6.
J.
McPherson
 et al.,
J. Appl. Phys.
88
,
5351
(
2000
).
7.
J.
McPherson
and
R.
Khamankar
,
Semicond. Sci. Technol.
15
,
462
(
2000
).
8.
J.
McPherson
 et al.,
IEEE Trans. Electron Devices
50
,
1771
(
2003
).
9.
J.
McPherson
,
J. Appl. Phys.
95
,
8101
(
2004
).
10.
P.
Lenahan
 et al.,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
2001
), p.
150
.
11.
J.
Lee
,
I.
Chen
, and
C.
Hu
,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
1988
), p.
131
.
12.
D.
DiMaria
and
J.
Stasiak
,
J. Appl. Phys.
65
,
2342
(
1989
).
13.
L.
Pauling
,
The Nature of the Chemical Bond
, 3rd Ed. (
Cornell University Press
,
Ithaca
,
1960
), p.
85
.
14.
Handbook of Chemistry and Physics
, 81st ed., edited by
D.
Lide
(
CRC
,
NY
,
2000
), pp.
5
22
.
15.
P.
Atkins
,
Physical Chemistry
, 5th ed. (
Freeman
,
San Francisco
,
1996
), C7.
16.
17.
N.
Capron
 et al.,
J. Chem. Phys.
117
,
1843
(
2002
).
18.
V.
Sulimov
 et al.,
Phys. Rev. B
66
,
024108
(
2002
).
19.
L.
Martin-Samos
 et al.,
Phys. Rev. B
71
,
014116
(
2005
).
20.
21.
A.
Bongiorno
and
A.
Pasquarello
,
Phys. Rev. B
62
,
R16326
(
2000
).
22.
N.
Ashcroft
and
D.
Mermin
,
Solid State Physics
(
Harcourt Brace College
,
Orlando, FL
,
1976
). pp.
395
414
.
23.
W.
Harrison
,
Applied Quantum Mechanics
(
World Scientific
,
Singapore
,
2000
), pp.
88
103
.
24.
M.
Dove
 et al.,
Phys. Chem. Miner.
24
,
311
(
1997
).
25.
A.
West
,
Solid State Chemistry and its Applications
(
Wiley
,
New York
,
1998
), p.
278
.
26.
J.
McPherson
,
Oxide Reliability
, edited by
D.
Dumin
(
World Scientific
,
Singapore
,
2002
), pp.
135
171
;
Int. J. High Speed Electron. Syst.
11
,
751
(
2001
).
27.
T.
Yang
and
K.
Saraswat
,
IEEE Trans. Electron Devices
47
,
746
(
2000
).
28.
E.
Rosenbaum
,
J.
King
, and
C.
Hu
,
IEEE Trans. Electron Devices
43
,
70
(
1996
).
29.
R.
Degrave
 et al.,
IEEE Trans. Electron Devices
45
,
904
(
1998
).
30.
J.
Sune
,
D.
Jimenez
, and
E.
Miranda
,
Oxide Reliability
, edited by
D.
Dumin
(
World Scientific
,
Singapore
,
2002
) pp.
135
171
;
Int. J. High Speed Electron. Syst.
11
,
789
(
2001
).
31.
K.
Schuegraph
and
C.
Hu
,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
1993
), p.
7
.
32.
R.
Moazzami
,
J.
Lee
, and
C.
Hu
,
IEEE Trans. Electron Devices
36
,
2462
(
1989
).
33.
J.
Suehle
and
P.
Chaparala
,
IEEE Trans. Electron Devices
44
,
801
(
1997
).
34.
A.
Shaware
,
R.
Khamankar
, and
J.
McPherson
,
Tech. Dig. - Int. Electron Devices Meet.
2000
,
549
.
35.
D.
DiMaria
,
Appl. Phys. Lett.
61
,
2329
(
1992
).
36.
D.
DiMaria
,
Solid-State Electron.
41
,
957
(
1997
).
37.
J.
Stathis
and
D.
DiMaria
,
Tech. Dig. - Int. Electron Devices Meet.
1998
,
167
.
38.
T.
Pompl
 et al.,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
2005
), p.
388
.
39.
J.
Rudra
and
W.
Fowler
,
Phys. Rev. B
35
,
8223
(
1987
).
40.
R.
Scott
 et al.,
International Reliability Physics Proceedings
(
IEEE
,
Piscataway, NJ
,
1995
), p.
130
.
41.
M.
Ojovan
and
W.
Lee
,
J. Appl. Phys.
95
,
3803
(
2004
).
You do not currently have access to this content.