The stress evolution during electrodeposition of NiMn from a sulfamate-based bath was investigated as a function of Mn concentration and current density. The NiMn stress evolution with film thickness exhibited an initial high transitional stress region followed by a region of steady-state stress with a magnitude that depended on deposition rate, similar to the previously reported stress evolution in electrodeposited Ni [S. J. Hearne and J. A. Floro, J. Appl. Phys. 97, 014901–1 (2005)]. The incorporation of increasing amounts of Mn resulted in a linear increase in the steady-state stress at constant current density. However, no significant changes in the texture or grain size were observed, which indicates that an atomistic process is driving the changes in steady-state stress. Additionally, microstrain measured by ex situ x-ray diffraction increased with increasing Mn content, which was likely the result of localized lattice distortions associated with substitutional incorporation of Mn and∕or increased twin density.
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1 March 2006
Research Article|
March 09 2006
Stress creation during Ni–Mn alloy electrodeposition
Sean J. Hearne;
Sean J. Hearne
a)
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Jerrold A. Floro;
Jerrold A. Floro
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Mark A. Rodriguez;
Mark A. Rodriguez
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Ralph T. Tissot;
Ralph T. Tissot
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Colleen S. Frazer;
Colleen S. Frazer
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Luke Brewer;
Luke Brewer
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Paul Hlava;
Paul Hlava
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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Stephen Foiles
Stephen Foiles
Sandla National Laboratories
, Albuquerque, New Mexico 87185
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a)
Electronic mail: [email protected]
J. Appl. Phys. 99, 053517 (2006)
Article history
Received:
July 18 2005
Accepted:
January 24 2006
Citation
Sean J. Hearne, Jerrold A. Floro, Mark A. Rodriguez, Ralph T. Tissot, Colleen S. Frazer, Luke Brewer, Paul Hlava, Stephen Foiles; Stress creation during Ni–Mn alloy electrodeposition. J. Appl. Phys. 1 March 2006; 99 (5): 053517. https://doi.org/10.1063/1.2179138
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