Role of sapphire nitridation temperature on GaN growth by plasma assisted molecular beam epitaxy: Part II. Interplay between chemistry and structure of layers

The effect of sapphire nitridation temperature on the chemistry and microstructure of the sapphire substrate/GaN interface, nucleation layer, and of the GaN epilayers grown by rf plasma assisted molecular beam epitaxy is investigated. It is found that a sapphire nitridation temperature as low as $200 °C$ improves the structural and optical quality of GaN epilayers. This result can be explained by the chemistry of the sapphire nitridation process, which is discussed in the framework of a model considering the competitive formation of AlN and oxynitride (NO). In particular, at $200 °C,$ NO desorbs from the sapphire surface, yielding an homogeneous 6 Å AlN layer upon $N2$ plasma nitridation. This low temperature AlN template favors the nucleation of hexagonal GaN nuclei which coalesce completely resulting in a hexagonal GaN buffer layer that homogeneously covers the sapphire substrate. This condition promotes the growth of a high quality GaN epilayer. In contrast, high nitridation temperatures result in a mixed AlN/NO nitrided sapphire surface which induce a perturbed and more defected interface with the occurrence of cubic crystallites in the GaN buffer. A sapphire surface with random GaN islands is found upon annealing of the GaN buffer and this condition results in a low-quality GaN epilayer.