Experiments have demonstrated that nitridation provides critically important improvements in the quality of interface. This article provides results and analysis aimed at developing the much needed understanding of the mechanisms and effects associated with both annealing of pregrown oxides and direct growth in NO and environments. According to the model proposed in the article, nitridation plays a double role: (1) creation of strong Si≡N bonds that passivate interface traps due to dangling and strained bonds, and (2) removal of carbon and associated complex silicon–oxycarbon bonds from the interface. This understanding of the effects of nitridation is experimentally verified and used to design a superior process for gate oxide growth in the industry-preferred environment.
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15 November 2001
Research Article|
November 15 2001
Effects of nitridation in gate oxides grown on 4H-SiC
Philippe Jamet;
Philippe Jamet
School of Microelectronic Engineering, Griffith University, Nathan, Queensland 4111, Australia
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Sima Dimitrijev;
Sima Dimitrijev
School of Microelectronic Engineering, Griffith University, Nathan, Queensland 4111, Australia
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Philip Tanner
Philip Tanner
School of Microelectronic Engineering, Griffith University, Nathan, Queensland 4111, Australia
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J. Appl. Phys. 90, 5058–5063 (2001)
Article history
Received:
April 09 2001
Accepted:
August 24 2001
Citation
Philippe Jamet, Sima Dimitrijev, Philip Tanner; Effects of nitridation in gate oxides grown on 4H-SiC. J. Appl. Phys. 15 November 2001; 90 (10): 5058–5063. https://doi.org/10.1063/1.1412579
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