Bimetal ‘‘T‐gate’’ structures have been obtained by selective Ti‐Al plasma etching. These structures have been used as self‐aligned masks for ohmic contact metallizations. Titanium Schottky diodes exhibit a barrier height of 720 mV with an ideality factor of 1.17. By using only the optical lithographic process, normally on GaAs metal Schottky field‐effect transistors (MESFET) of 1.3‐μm gate length have been fabricated. Transconductance up to 142 mS mm1 and pinchoff voltage around −2 V have been measured.

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